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Patent applications and USPTO patent grants for Eastep; Brian Lee.The latest application filed is for "completely encapsulated top electrode of a ferroelectric capacitor using a lead-enhanced encapsulation layer".
Patent | Date |
---|---|
Completely encapsulated top electrode of a ferroelectric capacitor using a lead-enhanced encapsulation layer Grant 6,281,023 - Eastep , et al. August 28, 2 | 2001-08-28 |
Completely encapsulated top electrode of a ferroelectric capacitor using a lead-enhanced encapsulation layer App 20010001488 - Eastep, Brian Lee ;   et al. | 2001-05-24 |
Multi-layer approach for optimizing ferroelectric film performance Grant 6,090,443 - Eastep July 18, 2 | 2000-07-18 |
Multi-layer approach for optimizing ferroelectric film performance Grant 6,080,499 - Eastep June 27, 2 | 2000-06-27 |
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