Eaglestone Partners I, LLC

Patent Applications and Registrations

Patent applications and USPTO patent grants for Eaglestone Partners I, LLC.The latest application filed is for "method for producing a wafer interposer for use in a wafer interposer assembly".

Company Profile

0.16.0

Eaglestone Partners I, LLC - Long Beach CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method for producing a wafer interposer for use in a wafer interposer assembly Grant 7,036,218 - Pierce May 2, 2	2006-05-02
Wafer-interposer assembly Grant 6,967,494 - Kline November 22, 2	2005-11-22
Wafer interposer assembly Grant 6,933,617 - Pierce August 23, 2	2005-08-23
Method for constructing a wafer-interposer assembly Grant 6,927,083 - Kline August 9, 2	2005-08-09
System for testing semiconductor die on multiple semiconductor wafers Grant 6,927,593 - Kline August 9, 2	2005-08-09
Wafer level interposer Grant 6,825,678 - Kline November 30, 2	2004-11-30
Method for testing multiple semiconductor wafers Grant 6,822,469 - Kline November 23, 2	2004-11-23
Method for selecting components for a matched set from a wafer-interposer assembly Grant 6,815,712 - Kline November 9, 2	2004-11-09
Method for manufacturing a wafer-interposer assembly Grant 6,812,048 - Kline November 2, 2	2004-11-02
Matched set of integrated circuit chips selected from a multi wafer-interposer Grant 6,759,741 - Kline July 6, 2	2004-07-06
Interposer for improved handling of semiconductor wafers and method of use of same Grant 6,686,657 - Kline February 3, 2	2004-02-03
Wafer-interposer using a ceramic substrate Grant 6,673,653 - Pierce January 6, 2	2004-01-06
Method for selecting components for a matched set using a multi wafer interposer Grant 6,537,831 - Kline March 25, 2	2003-03-25
Method, apparatus and system for building an interposer onto a semiconductor wafer using laser techniques Grant 6,524,885 - Pierce February 25, 2	2003-02-25
Chip assembly with integrated power distribution between a wafer interposer and an integrated circuit chip Grant 6,483,043 - Kline November 19, 2	2002-11-19
Method for selecting components for a matched set using wafer interposers Grant 6,483,330 - Kline November 19, 2	2002-11-19

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