loadpatents
name:-0.011812925338745
name:-0.0099151134490967
name:-0.00061511993408203
Eadara; Rajan Patent Filings

Eadara; Rajan

Patent Applications and Registrations

Patent applications and USPTO patent grants for Eadara; Rajan.The latest application filed is for "sprayable, carbon fiber-epoxy material and process".

Company Profile
0.8.7
  • Eadara; Rajan - Ann Arbor MI
  • Eadara; Rajan - East Lansing MI
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Sprayable, carbon fiber-epoxy material and process
Grant 9,963,588 - Eadara , et al. May 8, 2
2018-05-08
Sprayable, Carbon Fiber-epoxy Material And Process
App 20150322216 - Eadara; Rajan ;   et al.
2015-11-12
Constrained Layer, Composite, Acoustic Damping Material
App 20090277716 - Eadara; Rajan ;   et al.
2009-11-12
Two layer pumpable sound deadener
Grant 7,448,671 - Rackers , et al. November 11, 2
2008-11-11
Method Of Insulating A Pipeline And Materials Therefor
App 20070141281 - Eadara; Rajan ;   et al.
2007-06-21
Two layer pumpable sound deadener
App 20060054385 - Rackers; Craig ;   et al.
2006-03-16
Constrained layer, composite, acoustic damping material
App 20060040096 - Eadara; Rajan ;   et al.
2006-02-23
Two component, curable, hot melt adhesive
Grant 6,861,464 - Eadara , et al. March 1, 2
2005-03-01
Non-polyvinyl chloride, interpenetrating network epoxy/urethane acrylates
Grant 6,734,263 - Eadara , et al. May 11, 2
2004-05-11
Two component, curable, hot melt adhesive
App 20040014866 - Eadara, Rajan ;   et al.
2004-01-22
Non-polyvinyl chloride, interpenetrating network epoxy/urethane acrylates
App 20030119987 - Eadara, Rajan ;   et al.
2003-06-26
Radiation-cured, non-blocking heat activated label adhesive and coatings and method for using same
Grant 6,210,517 - Eadara , et al. April 3, 2
2001-04-03
Room temperature storage-stable, heat-curable, low CTE, one component epoxy resin tooling material
Grant 5,859,096 - Hoge , et al. January 12, 1
1999-01-12
Thermoplastic hot melt adhesive
Grant 5,169,890 - Eadara , et al. December 8, 1
1992-12-08
Accelerated curing systems for epoxy resins
Grant 4,894,431 - Armbruster , et al. January 16, 1
1990-01-16

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