Dyer; Lawrence D.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Dyer; Lawrence D..The latest application filed is for "method of reducing wafer particles after partial saw using a superhard protective coating".
- Dyer; Lawrence D. - Richardson TX
| Patent | Date |
|---|---|
| Method of reducing wafer particles after partial saw using a superhard protective coating Grant 6,063,696 - Brenner , et al. May 16, 2 | 2000-05-16 |
| Method of reducing wafer particles after partial saw Grant 5,817,569 - Brenner , et al. October 6, 1 | 1998-10-06 |
| Separation of wafer into die with wafer-level processing Grant 5,597,767 - Mignardi , et al. January 28, 1 | 1997-01-28 |
| Semiconductor wafer edge polishing system and method Grant 5,595,522 - Simpson , et al. January 21, 1 | 1997-01-21 |
| Notch beveling on semiconductor wafer edges Grant 5,289,661 - Jones , et al. March 1, 1 | 1994-03-01 |
| Method for polishing semiconductor wafer edges Grant 5,274,959 - Dyer , et al. January 4, 1 | 1994-01-04 |
| Semiconductor wafer stacking apparatus and method Grant 5,240,557 - Dyer , et al. August 31, 1 | 1993-08-31 |
| Method for polishing semiconductor wafer edges Grant 5,128,281 - Dyer , et al. July 7, 1 | 1992-07-07 |
| Iodine sterilization of deionized water in semiconductor processing Grant 4,935,064 - Robbins , et al. June 19, 1 | 1990-06-19 |
| Production Of Semiconductor Material Grant 3,647,530 - Dyer March 7, 1 | 1972-03-07 |
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