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Patent applications and USPTO patent grants for Dyconex Patente AG.The latest application filed is for "method for producing micro-openings".
Patent | Date |
---|---|
Method for producing micro-openings Grant 6,601,297 - Schmidt August 5, 2 | 2003-08-05 |
Process for producing connecting conductors Grant 6,486,394 - Schmidt , et al. November 26, 2 | 2002-11-26 |
Connection substrate Grant 6,321,443 - Barte , et al. November 27, 2 | 2001-11-27 |
Thin laminated microstructure with precisely aligned openings Grant 5,698,299 - Schmidt , et al. December 16, 1 | 1997-12-16 |
Process for the production of structures Grant 5,639,389 - Schmidt , et al. June 17, 1 | 1997-06-17 |
Method for the through plating of conductor foils Grant 5,457,881 - Schmidt October 17, 1 | 1995-10-17 |
Core for electrical connecting substrates and electrical connecting substrates with core, as well as process for the production thereof Grant 5,442,143 - Schmidt , et al. August 15, 1 | 1995-08-15 |
Process for the production of printed circuit boards with extremely dense wiring using a metal-clad laminate Grant 5,436,062 - Schmidt , et al. July 25, 1 | 1995-07-25 |
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