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name:-0.001582145690918
name:-0.0066351890563965
name:-0.00075888633728027
Dyconex Patente AG Patent Filings

Dyconex Patente AG

Patent Applications and Registrations

Patent applications and USPTO patent grants for Dyconex Patente AG.The latest application filed is for "method for producing micro-openings".

Company Profile
0.8.0
  • Dyconex Patente AG - Zug CH
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Method for producing micro-openings
Grant 6,601,297 - Schmidt August 5, 2
2003-08-05
Process for producing connecting conductors
Grant 6,486,394 - Schmidt , et al. November 26, 2
2002-11-26
Connection substrate
Grant 6,321,443 - Barte , et al. November 27, 2
2001-11-27
Thin laminated microstructure with precisely aligned openings
Grant 5,698,299 - Schmidt , et al. December 16, 1
1997-12-16
Process for the production of structures
Grant 5,639,389 - Schmidt , et al. June 17, 1
1997-06-17
Method for the through plating of conductor foils
Grant 5,457,881 - Schmidt October 17, 1
1995-10-17
Core for electrical connecting substrates and electrical connecting substrates with core, as well as process for the production thereof
Grant 5,442,143 - Schmidt , et al. August 15, 1
1995-08-15
Process for the production of printed circuit boards with extremely dense wiring using a metal-clad laminate
Grant 5,436,062 - Schmidt , et al. July 25, 1
1995-07-25

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