Dyckman; Warren D.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Dyckman; Warren D..The latest application filed is for "opto-electronic module with improved low power, high speed electrical signal integrity".

Company Profile

0.8.6

Dyckman; Warren D. - Peekskill NY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Structure for an apparatus for monitoring and controlling heat generation in a multi-core processor Grant 8,214,660 - Capps, Jr. , et al. July 3, 2	2012-07-03
Opto-electronic Module With Improved Low Power, High Speed Electrical Signal Integrity App 20110206379 - Budd; Russell A. ; et al.	2011-08-25
System and method to optimize multi-core microprocessor performance using voltage offsets Grant 7,721,119 - Capps, Jr. , et al. May 18, 2	2010-05-18
Method and apparatus for controlling heat generation in a multi-core processor Grant 7,617,403 - Capps, Jr. , et al. November 10, 2	2009-11-10
Method and apparatus for monitoring and controlling heat generation in a multi-core processor Grant 7,584,369 - Capps, Jr. , et al. September 1, 2	2009-09-01
Design Structure For An Apparatus For Monitoring And Controlling Heat Generation In A Multi-Core Processor App 20090177445 - Capps, JR.; Louis Bennie ; et al.	2009-07-09
System and Method to Optimize Multi-Core Microprocessor Performance Using Voltage Offsets App 20080052542 - Capps; Louis Bennie ; et al.	2008-02-28
Method and Apparatus for Monitoring and Controlling Heat Generation in a Multi-Core Processor App 20080028244 - Capps; Louis Bennie ; et al.	2008-01-31
Method and Apparatus for Controlling Heat Generation in a Multi-Core Processor App 20080028236 - Capps; Louis Bennie ; et al.	2008-01-31
Clearance hole size adjustment for impedance control in multilayer electronic packaging and printed circuit boards Grant 7,271,681 - Dyckman , et al. September 18, 2	2007-09-18
Clearance Hole Size Adjustment For Impedance Control In Multilayer Electronic Packaging And Printed Circuit Boards App 20070008049 - Dyckman; Warren D. ; et al.	2007-01-11
In-module current source Grant 7,085,143 - Dyckman , et al. August 1, 2	2006-08-01
Multi-step transmission line for multilayer packaging Grant 6,680,530 - Pillai , et al. January 20, 2	2004-01-20
High density thermal solution for direct attach modules Grant 6,657,864 - Dyckman , et al. December 2, 2	2003-12-02

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