Dutt; Gyanendra
Patent Applications and Registrations
Patent applications and USPTO patent grants for Dutt; Gyanendra.The latest application filed is for "wafer back side coating as dicing tape adhesive".
- Dutt; Gyanendra - Garden Grove CA
- Dutt; Gyanendra - Piscataway NJ
- Dutt, Gyanendra - Edison NJ
| Patent | Date |
|---|---|
| Wafer back side coating as dicing tape adhesive Grant 9,230,888 - Dutt , et al. January 5, 2 | 2016-01-05 |
| Wafer Back Side Coating As Dicing Tape Adhesive App 20140225283 - Dutt; Gyanendra ; et al. | 2014-08-14 |
| Adhesive Recycling During Spin Coating App 20130136858 - DUTT; Gyanendra ; et al. | 2013-05-30 |
| Dual Cure Adhesives App 20130102698 - LEON; JEFFREY ; et al. | 2013-04-25 |
| B-stageable underfill encapsulant and method for its application Grant 7,608,487 - Xiao , et al. October 27, 2 | 2009-10-27 |
| Underfill encapsulant for wafer packaging and method for its application App 20060194064 - Xiao; Allison Yue ; et al. | 2006-08-31 |
| B-stageable underfill encapsulant and method for its application App 20060125119 - Xiao; Allison Yue ; et al. | 2006-06-15 |
| B-stageable underfill encapsulant and method for its application App 20030164555 - Tong, Quinn K. ; et al. | 2003-09-04 |
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