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Patent applications and USPTO patent grants for Durado; Daniel.The latest application filed is for "plating systems having reduced air entrainment".
Patent | Date |
---|---|
Plating Systems Having Reduced Air Entrainment App 20200152467 - Law; Cameron ;   et al. | 2020-05-14 |
Method for single wafer processing in which a semiconductor wafer is contacted with a fluid Grant 5,230,743 - Thompson , et al. July 27, 1 | 1993-07-27 |
Single wafer processor Grant 5,224,504 - Thompson , et al. July 6, 1 | 1993-07-06 |
Single wafer processor Grant 5,168,886 - Thompson , et al. December 8, 1 | 1992-12-08 |
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