DUPONT AIR PRODUCTS NANOMATERIALS, LLC

Patent Applications and Registrations

Patent applications and USPTO patent grants for DUPONT AIR PRODUCTS NANOMATERIALS, LLC.The latest application filed is for "cmp slurry/method for polishing ruthenium and other films".

Company Profile

2.29.16

DUPONT AIR PRODUCTS NANOMATERIALS, LLC - Allentown PA
DuPont Air Products Nanomaterials LLC - Tempe AZ
DuPont Air Products NanoMaterials LLC -
Dupont Air Products Nanomaterials LLC - Wilmington DE
DuPont Air Products NanoMaterials L.L.C. - Tempe AZ
DuPont Air Products Nanomaterials LLC - Carlsbad CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
CMP Slurry/Method for Polishing Ruthenium and Other Films App 20120329279 - Shi; Xiaobo	2012-12-27
Method and composition for chemical mechanical planarization of a metal-containing substrate Grant 8,222,145 - Shi July 17, 2	2012-07-17
Chemical Mechanical Planarization Composition And Method With Low Corrosiveness App 20120142191 - Shi; Xiaobo ; et al.	2012-06-07
Fluoride-modified silica sols for chemical mechanical planarization Grant 8,163,049 - Siddiqui April 24, 2	2012-04-24
Dihydroxy enol compounds used in chemical mechanical polishing compositions having metal ion oxidizers Grant 8,114,775 - Siddiqui , et al. February 14, 2	2012-02-14
Method for Chemical Mechanical Planarization of a Tungsten-Containing Substrate App 20120028466 - McConnell; Rachel Dianne ; et al.	2012-02-02
Method For Chemical Mechanical Planarization Of A Copper-containing Substrate App 20110312181 - Shi; Xiaobo	2011-12-22
Method for Forming Through-Base Wafer Vias for Fabrication of Stacked Devices App 20110300710 - Henry; James Matthew ; et al.	2011-12-08
Compositions and methods for rapidly removing overfilled substrates Grant 8,057,696 - Chelle , et al. November 15, 2	2011-11-15
Method For Exposing Through-base Wafer Vias For Fabrication Of Stacked Devices App 20110237079 - Kim; Hyoung Sik ; et al.	2011-09-29
Method and Slurry for Tuning Low-K Versus Copper Removal Rates During Chemical Mechanical Polishing App 20110165777 - Siddiqui; Junaid Ahmed ; et al.	2011-07-07
Periodic acid compositions for polishing ruthenium/low K substrates Grant 7,968,465 - Small , et al. June 28, 2	2011-06-28
Method for chemical mechanical planarization of chalcogenide materials Grant 7,915,071 - Siddiqui , et al. March 29, 2	2011-03-29
Method and Composition for Chemical Mechanical Planarization of A Metal App 20100167545 - Shi; Xiaobo ; et al.	2010-07-01
Polishing Slurry for Copper Films App 20100101448 - Sawayda; Rebecca A. ; et al.	2010-04-29
Method for immobilizing ligands and organometallic compounds on silica surface, and their application in chemical mechanical planarization Grant 7,691,287 - Siddiqui , et al. April 6, 2	2010-04-06
Method for Forming Through-base Wafer Vias in Fabrication of Stacked Devices App 20100081279 - Palmer; Bentley J. ; et al.	2010-04-01
Method for chemical mechanical planarization of chalcogenide materials Grant 7,678,605 - Schlueter , et al. March 16, 2	2010-03-16
Compositions of chemical mechanical planarization slurries contacting noble-metal-featured substrates Grant 7,524,346 - Small , et al. April 28, 2	2009-04-28
Chemical-mechanical planarization composition having benzenesulfonic acid and per-compound oxidizing agents, and associated method for use Grant 7,514,363 - Banerjee , et al. April 7, 2	2009-04-07
Free radical-forming activator attached to solid and used to enhance CMP formulations Grant 7,513,920 - Siddiqui , et al. April 7, 2	2009-04-07
Method for Chemical Mechanical Planarization of Chalcogenide Materials App 20090057661 - Siddiqui; Junaid Ahmed ; et al.	2009-03-05
Method for Chemical Mechanical Planarization of A Metal-containing Substrate App 20090061630 - Palmer; Bentley J. ; et al.	2009-03-05
Method for Chemical Mechanical Planarization of Chalcogenide Materials App 20090057834 - Schlueter; James Allen ; et al.	2009-03-05
Reverse Shallow Trench Isolation Process App 20090047870 - Siddiqui; Junaid Ahmed ; et al.	2009-02-19
Free radical-forming activator attached to solid and used to enhance CMP formulations App 20090029553 - Scott; Brandon Shane ; et al.	2009-01-29
Dihydroxy enol compounds used in chemical mechanical polishing compositions having metal ion oxidizers Grant 7,476,620 - Siddiqui , et al. January 13, 2	2009-01-13
Surface modified colloidal abrasives, including stable bimetallic surface coated silica sols for chemical mechanical planarization Grant 7,429,338 - Siddiqui September 30, 2	2008-09-30
Particulate or particle-bound chelating agents Grant 7,427,361 - Small , et al. September 23, 2	2008-09-23
Free radical-forming activator attached to solid and used to enhance CMP formulations Grant 7,427,305 - Scott , et al. September 23, 2	2008-09-23
Composition and associated method for catalyzing removal rates of dielectric films during chemical mechanical planarization Grant 7,351,662 - Siddiqui , et al. April 1, 2	2008-04-01
Alumina abrasive for chemical mechanical polishing Grant 7,344,988 - Chelle March 18, 2	2008-03-18
Polishing method to reduce dishing of tungsten on a dielectric Grant 7,316,976 - Nojo , et al. January 8, 2	2008-01-08
Chemical mechanical polishing composition and process Grant 7,276,180 - Small , et al. October 2, 2	2007-10-02
CMP method for copper, tungsten, titanium, polysilicon, and other substrates using organosulfonic acids as oxidizers Grant 7,247,566 - Carter , et al. July 24, 2	2007-07-24
Tunable composition and method for chemical-mechanical planarization with aspartic acid/tolyltriazole Grant 7,153,335 - Siddiqui , et al. December 26, 2	2006-12-26
Free radical-forming activator attached to solid and used to enhance CMP formulations App 20060180788 - Scott; Brandon Shane ; et al.	2006-08-17
Surface modified colloidal abrasives, including stable bimetallic surface coated silica sols for chemical mechanical planarization Grant 7,077,880 - Siddiqui July 18, 2	2006-07-18
Chemical mechanical polishing composition and process Grant 7,033,942 - Small , et al. April 25, 2	2006-04-25
Catalyst attached to solid and used to promote free radical formation in CMP formulations Grant 7,029,508 - Scott , et al. April 18, 2	2006-04-18
Chemical-mechanical planarization composition with nitrogen containing polymer and method for use Grant 7,022,255 - Siddiqui , et al. April 4, 2	2006-04-04
Catalytic composition for chemical-mechanical polishing, method of using same, and substrate treated with same Grant 7,014,669 - Small , et al. March 21, 2	2006-03-21
Low defectivity product slurry for CMP and associated production method Grant 6,979,252 - Siddiqui , et al. December 27, 2	2005-12-27
Composition and associated methods for chemical mechanical planarization having high selectivity for metal removal Grant 6,893,476 - Siddiqui , et al. May 17, 2	2005-05-17
Gel-free colloidal abrasive polishing compositions and associated methods Grant 6,743,267 - Jernakoff , et al. June 1, 2	2004-06-01

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