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Patent applications and USPTO patent grants for Duong; Benjamin.The latest application filed is for "electronic substrates having embedded inductors".
Patent | Date |
---|---|
Electronic Substrates Having Embedded Inductors App 20220093534 - Duong; Benjamin ;   et al. | 2022-03-24 |
Electronic Substrates Having Embedded Inductors App 20220093535 - Duong; Benjamin ;   et al. | 2022-03-24 |
Electronic Substrates Having Embedded Inductors App 20220093316 - Duong; Benjamin ;   et al. | 2022-03-24 |
Radio Frequency Antennas And Waveguides For Communication Between Integrated Circuit Devices App 20220084962 - Aleksov; Aleksandar ;   et al. | 2022-03-17 |
Multiple Layer Copper Seeding App 20210090946 - GRUJICIC; Darko ;   et al. | 2021-03-25 |
Copper Interface Features For High Speed Interconnect Applications App 20200315023 - NAD; Suddhasattwa ;   et al. | 2020-10-01 |
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