Dunne; Rajiv Carl

Patent Applications and Registrations

Patent applications and USPTO patent grants for Dunne; Rajiv Carl.The latest application filed is for "low-cost flip-chip interconnect with an integrated wafer-applied photo-sensitive adhesive and metal-loaded epoxy paste system".

Company Profile

0.3.5

Dunne; Rajiv Carl - Murphy TX
Dunne; Rajiv Carl - Irving TX

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Low-cost Flip-chip Interconnect With An Integrated Wafer-applied Photo-sensitive Adhesive And Metal-loaded Epoxy Paste System App 20100159644 - Dunne; Rajiv Carl ; et al.	2010-06-24
Arrangement in semiconductor packages for inhibiting adhesion of lid to substrate while providing compression support Grant 7,572,677 - Chiu , et al. August 11, 2	2009-08-11
Stacked Flip-assembled Semiconductor Chips Embedded In Thin Hybrid Substrate App 20090166832 - Dunne; Rajiv Carl	2009-07-02
Stacked-flip-assembled semiconductor chips embedded in thin hybrid substrate Grant 7,504,283 - Dunne March 17, 2	2009-03-17
Stacked-flip-assembled Semiconductor Chips Embedded In Thin Hybrid Substrate App 20080142940 - Dunne; Rajiv Carl	2008-06-19
Arrangement in Semiconductor Packages for Inhibiting Adhesion of Lid to Substrate While Providing Compression Support App 20070004083 - Chiu; Tz-Cheng ; et al.	2007-01-04
Arrangement in semiconductor packages for inhibiting adhesion of lid to substrate while providing compression support Grant 7,126,217 - Chiu , et al. October 24, 2	2006-10-24
Arrangement in semiconductor packages for inhibiting adhesion of lid to substrate while providing compression support App 20060027921 - Chiu; Tz-Cheng ; et al.	2006-02-09

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