Dungan; John H
Patent Applications and Registrations
Patent applications and USPTO patent grants for Dungan; John H.The latest application filed is for "electronic packaging using conductive interproser connector".
- Dungan; John H - Hillsboro OR
- Dungan; John H. - Hillsboro OR
| Patent | Date |
|---|---|
| Apparatus for providing an integrated printed circuit board registration coupon Grant 7,583,513 - Boggs , et al. September 1, 2 | 2009-09-01 |
| Electronic packaging using conductive interproser connector Grant 7,385,288 - Boggs , et al. June 10, 2 | 2008-06-10 |
| Three-dimensional flexible interposer Grant 7,325,303 - Boggs , et al. February 5, 2 | 2008-02-05 |
| Electronic Packaging Using Conductive Interproser Connector App 20070228562 - Boggs; David W. ; et al. | 2007-10-04 |
| Electronic packaging using conductive interposer connector Grant 7,241,680 - Boggs , et al. July 10, 2 | 2007-07-10 |
| Three-dimensional flexible interposer App 20070082512 - Boggs; David W. ; et al. | 2007-04-12 |
| Three-dimensional flexible interposer Grant 7,201,583 - Boggs , et al. April 10, 2 | 2007-04-10 |
| PCB method and apparatus for producing landless interconnects Grant 7,084,354 - Boggs , et al. August 1, 2 | 2006-08-01 |
| Electronic packaging using conductive interposer connector App 20050242434 - Boggs, David W. ; et al. | 2005-11-03 |
| Standoff devices and methods of using same Grant 6,941,537 - Jessep , et al. September 6, 2 | 2005-09-06 |
| Three-dimensional Flexible Interposer App 20050142900 - Boggs, David W. ; et al. | 2005-06-30 |
| Method and apparatus for providing an integrated printed circuit board registration coupon App 20050063166 - Boggs, David W. ; et al. | 2005-03-24 |
| PCB design and method for providing vented blind vias App 20040231886 - Boggs, David W. ; et al. | 2004-11-25 |
| Electronic substrate with direct inner layer component interconnection App 20040219342 - Boggs, David W. ; et al. | 2004-11-04 |
| PCB design and method for providing vented blind vias Grant 6,787,443 - Boggs , et al. September 7, 2 | 2004-09-07 |
| Coupon registration mechanism and method Grant 6,667,090 - Boggs , et al. December 23, 2 | 2003-12-23 |
| PCB method and apparatus for producing landless interconnects App 20030231474 - Boggs, David W. ; et al. | 2003-12-18 |
| Standoff arrangements to control distance and provide electrical function App 20030145460 - Jessep, Rebecca A. ; et al. | 2003-08-07 |
| Vented vias for via in pad technology yield improvements Grant 6,580,174 - McCormick , et al. June 17, 2 | 2003-06-17 |
| Vented Vias For Via In Pad Technology Yield Improvements App 20030064546 - McCormick, Carolyn R. ; et al. | 2003-04-03 |
| Coupon registration mechanism and method App 20030056365 - Boggs, David W. ; et al. | 2003-03-27 |
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