name:-0.0093410015106201
name:-0.0069990158081055
name:-0.00098085403442383
Duncan; James E. Patent Filings

Duncan; James E.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Duncan; James E..The latest application filed is for "method and apparatus for remote plasma treatment for reducing metal oxides on a metal seed layer".

Company Profile
0.7.9
  • Duncan; James E. - Beaverton OR
  • Duncan; James E. - New York NY
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Trademarks
Patent Activity
PatentDate
Configuration and method of operation of an electrodeposition system for improved process stability and performance
Grant 10,745,817 - Ganesan , et al. A
2020-08-18
Method And Apparatus For Remote Plasma Treatment For Reducing Metal Oxides On A Metal Seed Layer
App 20180350670 - Spurlin; Tighe A. ;   et al.
2018-12-06
Configuration And Method Of Operation Of An Electrodeposition System For Improved Process Stability And Performance
App 20180038007 - Ganesan; Kousik ;   et al.
2018-02-08
Method And Apparatus For Electroplating Semiconductor Wafer When Controlling Cations In Electrolyte
App 20180030611 - Spurlin; Tighe A. ;   et al.
2018-02-01
Method and apparatus for remote plasma treatment for reducing metal oxides on a metal seed layer
Grant 9,865,501 - Spurlin , et al. January 9, 2
2018-01-09
Method and apparatus for electroplating semiconductor wafer when controlling cations in electrolyte
Grant 9,816,196 - Spurlin , et al. November 14, 2
2017-11-14
Configuration and method of operation of an electrodeposition system for improved process stability and performance
Grant 9,816,193 - Ganesan , et al. November 14, 2
2017-11-14
Electroplating and post-electrofill systems with integrated process edge imaging and metrology systems
Grant 9,809,898 - Dinneen , et al. November 7, 2
2017-11-07
Method And Apparatus For Remote Plasma Treatment For Reducing Metal Oxides On A Metal Seed Layer
App 20150072538 - Spurlin; Tighe A. ;   et al.
2015-03-12
Electroplating And Post-electrofill Systems With Integrated Process Edge Imaging And Metrology Systems
App 20150001087 - Dinneen; Daniel Mark ;   et al.
2015-01-01
Method And Apparatus For Remote Plasma Treatment For Reducing Metal Oxides On A Metal Seed Layer
App 20140256128 - Spurlin; Tighe A. ;   et al.
2014-09-11
Method And Apparatus For Electroplating Semiconductor Wafer When Controlling Cations In Electrolyte
App 20130284604 - Spurlin; Tighe A. ;   et al.
2013-10-31
Configuration And Method Of Operation Of An Electrodeposition System For Improved Process Stability And Performance
App 20120175263 - GANESAN; Kousik ;   et al.
2012-07-12
Door of adjustable height
Grant 4,020,595 - Duncan May 3, 1
1977-05-03

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