Dunaway; Thomas J.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Dunaway; Thomas J..The latest application filed is for "ic package lid for dose enhancement protection".
- Dunaway; Thomas J. - New Hope MN
- Dunaway; Thomas J. - St. Louis Park MN
- Dunaway; Thomas J. - Minneapolis MN
| Patent | Date |
|---|---|
| IC package lid for dose enhancement protection Grant 6,611,054 - Dunaway , et al. August 26, 2 | 2003-08-26 |
| Test and tear-away bond pad design Grant 5,891,745 - Dunaway , et al. April 6, 1 | 1999-04-06 |
| Semiconductor package with weldable ceramic lid Grant 5,498,900 - Dunaway , et al. March 12, 1 | 1996-03-12 |
| Package to semiconductor chip active interconnect site method Grant 5,161,729 - Dunaway , et al. November 10, 1 | 1992-11-10 |
| Method of making a surface etched shadow mask Grant 5,139,610 - Dunaway , et al. August 18, 1 | 1992-08-18 |
| Direct microcircuit decoupling Grant 5,140,496 - Heinks , et al. August 18, 1 | 1992-08-18 |
| Stacked tab leadframe assembly Grant 5,099,306 - Dunaway , et al. March 24, 1 | 1992-03-24 |
| Method of die bonding semiconductor chip by using removable frame Grant 5,074,036 - Dunaway , et al. * December 24, 1 | 1991-12-24 |
| Method of manufacturing a leadframe having conductive elements preformed with solder bumps Grant 5,066,614 - Dunaway , et al. November 19, 1 | 1991-11-19 |
| Universal semiconductor chip package Grant 5,066,831 - Spielberger , et al. November 19, 1 | 1991-11-19 |
| Universal semiconductor chip package Grant 5,036,163 - Spielberger , et al. July 30, 1 | 1991-07-30 |
| Package to board variable pitch tab Grant 4,999,700 - Dunaway , et al. March 12, 1 | 1991-03-12 |
| Method of manufacturing a high-yield solder bumped semiconductor wafer Grant 4,898,320 - Dunaway , et al. February 6, 1 | 1990-02-06 |
| Optoelectronic lens array with an integrated circuit Grant 4,528,446 - Dunaway , et al. July 9, 1 | 1985-07-09 |
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