DUKSAN HI-METAL CO., LTD.

Patent Applications and Registrations

Patent applications and USPTO patent grants for DUKSAN HI-METAL CO., LTD..The latest application filed is for "method of manufacturing metal nanowire and light-transmitting electrode and organic light-emitting device including metal nanowire manufactured thereby".

Company Profile

8.9.7

DUKSAN HI-METAL CO., LTD. - Ulsan KR
DUKSAN HI-METAL CO., LTD - Ulsan N/A KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Metal core solder ball and heat dissipation structure for semiconductor device using the same Grant 10,661,394 - Chu , et al.	2020-05-26
Method of manufacturing metal nanowire and light-transmitting electrode and organic light-emitting device including metal nanowire manufactured thereby Grant 10,651,414 - Yoo , et al.	2020-05-12
Metal nanowire and light-transmitting electrode and organic light-emitting device including the same Grant 10,636,994 - Yoo , et al.	2020-04-28
Core-shell nanowire, method for synthesizing the core-shell nanowire, and transparent electrode and organic light emitting diode including the core-shell nanowire Grant 10,629,838 - Yoo , et al.	2020-04-21
Method Of Manufacturing Metal Nanowire And Light-transmitting Electrode And Organic Light-emitting Device Including Metal Nanowire Manufactured Thereby App 20180323399 - YOO; Young Zo ; et al.	2018-11-08
Metal Nanowire And Light-transmitting Electrode And Organic Light-emitting Device Including The Same App 20180315947 - YOO; Young Zo ; et al.	2018-11-01
Core-shell Nanowire, Method For Synthesizing The Core-shell Nanowire, And Transparent Electrode And Organic Light Emitting Diode Including The Core-shell Nanowire App 20180026224 - YOO; Young Zo ; et al.	2018-01-25
Metal Core Solder Ball And Heat Dissipation Structure For Semiconductor Device Using The Same App 20140183733 - CHU; Yong Cheol ; et al.	2014-07-03
Lead free solder alloy Grant 8,221,560 - Kim , et al. July 17, 2	2012-07-17
Solder Adhesive And A Production Method For The Same, And An Electronic Device Comprising The Same App 20120067629 - Jang; Yong Un ; et al.	2012-03-22
Lead Free Solder Alloy And Manufacturing Method Thereof App 20100272598 - Kim; Kang Hee ; et al.	2010-10-28

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