Dufresne; Roger A.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Dufresne; Roger A..The latest application filed is for "test structures for dielectric reliability evaluations".

Company Profile

0.13.15

Dufresne; Roger A. - Fairfax VT
Dufresne; Roger A. - Essex Junction VT

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Test structures for dielectric reliability evaluations Grant 10,103,060 - Brochu, Jr. , et al. October 16, 2	2018-10-16
Via leakage and breakdown testing Grant 9,851,398 - Chen , et al. December 26, 2	2017-12-26
Wiring structures Grant 9,780,031 - Chen , et al. October 3, 2	2017-10-03
Test Structures For Dielectric Reliability Evaluations App 20160372389 - Brochu, JR.; David G. ; et al.	2016-12-22
Via Leakage And Breakdown Testing App 20160291084 - Chen; Fen ; et al.	2016-10-06
Non-planar field effect transistor test structure and lateral dielectric breakdown testing method Grant 9,453,873 - Chen , et al. September 27, 2	2016-09-27
Wiring Structures App 20160071790 - CHEN; Fen ; et al.	2016-03-10
Alternating Open-ended Via Chains For Testing Via Formation And Dielectric Integrity App 20150221567 - Chen; Fen ; et al.	2015-08-06
Non-planar Field Effect Transistor Test Structure And Lateral Dielectric Breakdown Testing Method App 20150198654 - Chen; Fen ; et al.	2015-07-16
Alternating open-ended via chains for testing via formation and dielectric integrity Grant 9,059,052 - Chen , et al. June 16, 2	2015-06-16
On-chip poly-to-contact process monitoring and reliability evaluation system and method of use Grant 9,029,172 - Chen , et al. May 12, 2	2015-05-12
Analyzing EM performance during IC manufacturing Grant 8,917,104 - Chen , et al. December 23, 2	2014-12-23
Alternating Open-ended Via Chains For Testing Via Formation And Dielectric Integrity App 20140339558 - Chen; Fen ; et al.	2014-11-20
Real-time on-chip EM performance monitoring Grant 8,890,556 - Chen , et al. November 18, 2	2014-11-18
Test structure, method and circuit for simultaneously testing time dependent dielectric breakdown and electromigration or stress migration Grant 8,754,655 - Brochu, Jr. , et al. June 17, 2	2014-06-17
On-chip Poly-to-contact Process Monitoring And Reliability Evaluation System And Method Of Use App 20130191047 - CHEN; Fen ; et al.	2013-07-25
Real-time On-chip Em Performance Monitoring App 20130106452 - Chen; Fen ; et al.	2013-05-02
Analyzing Em Performance During Ic Manufacturing App 20130049793 - Chen; Fen ; et al.	2013-02-28
Test Structure, Method And Circuit For Simultaneously Testing Time Dependent Dielectric Breakdown And Electromigration Or Stress Migration App 20130038334 - Brochu, JR.; David G. ; et al.	2013-02-14
Dual Stage Voltage Ramp Stress Test for Gate Dielectrics App 20120187974 - Brochu, JR.; David G. ; et al.	2012-07-26

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