Dudderar; Thomas Dixon
Patent Applications and Registrations
Patent applications and USPTO patent grants for Dudderar; Thomas Dixon.The latest application filed is for "method of testing and constructing monolithic multi-chip modules".
- Dudderar; Thomas Dixon - Chatham NJ
| Patent | Date |
|---|---|
| Stacked module package Grant 6,734,539 - Degani , et al. May 11, 2 | 2004-05-11 |
| Method of testing and constructing monolithic multi-chip modules Grant 6,680,212 - Degani , et al. January 20, 2 | 2004-01-20 |
| High performance multi-chip IC package Grant 6,678,167 - Degani , et al. January 13, 2 | 2004-01-13 |
| Multi-chip ball grid array IC packages Grant 6,437,990 - Degani , et al. August 20, 2 | 2002-08-20 |
| Packaging micromechanical devices Grant 6,433,411 - Degani , et al. August 13, 2 | 2002-08-13 |
| Method of testing and constructing monolithic multi-chip modules App 20020081755 - Degani, Yinon ; et al. | 2002-06-27 |
| Stacked module package App 20020079568 - Degani, Yinon ; et al. | 2002-06-27 |
| Interconnecting micromechanical devices Grant 6,396,711 - Degani , et al. May 28, 2 | 2002-05-28 |
| Packaging silicon on silicon multichip modules Grant 6,369,444 - Degani , et al. April 9, 2 | 2002-04-09 |
| Integrated circuit packages with improved EMI characteristics Grant 6,297,551 - Dudderar , et al. October 2, 2 | 2001-10-02 |
| Low cost ball grid array package Grant 6,282,100 - Degani , et al. August 28, 2 | 2001-08-28 |
| Low profile integrated circuit packages Grant 6,251,705 - Degani , et al. June 26, 2 | 2001-06-26 |
| High speed flip-chip dispensing Grant 6,205,745 - Dudderar , et al. March 27, 2 | 2001-03-27 |
| Interposer for recessed flip-chip package Grant 6,175,158 - Degani , et al. January 16, 2 | 2001-01-16 |
| Method of packaging fragile devices with a gel medium confined by a rim member Grant 6,020,219 - Dudderar , et al. February 1, 2 | 2000-02-01 |
| High speed flip-chip dispensing Grant 5,966,903 - Dudderar , et al. October 19, 1 | 1999-10-19 |
| Electronic device package enclosed by pliant medium laterally confined by a plastic rim member Grant 5,767,447 - Dudderar , et al. June 16, 1 | 1998-06-16 |
| Thin packaging of multi-chip modules with enhanced thermal/power management Grant 5,646,828 - Degani , et al. July 8, 1 | 1997-07-08 |
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