Duboust; Alain

Patent Applications and Registrations

Patent applications and USPTO patent grants for Duboust; Alain.The latest application filed is for "endpoint control of multiple substrate zones of varying thickness in chemical mechanical polishing".

Company Profile

1.50.84

Duboust; Alain - Sunnyvale CA
Duboust; Alain - Santa Clara CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Endpoint control of multiple substrate zones of varying thickness in chemical mechanical polishing Grant 10,589,397 - Duboust , et al.	2020-03-17
Transfer chamber metrology for improved device yield Grant 10,103,288 - Bour , et al. October 16, 2	2018-10-16
Endpoint Control Of Multiple Substrate Zones Of Varying Thickness In Chemical Mechanical Polishing App 20170151647 - Duboust; Alain ; et al.	2017-06-01
Transfer Chamber Metrology For Improved Device Yield App 20150263222 - Bour; David P. ; et al.	2015-09-17
Transfer chamber metrology for improved device yield Grant 9,076,827 - Bour , et al. July 7, 2	2015-07-07
Endpoint Control Of Multiple Substrates Of Varying Thickness On The Same Platen In Chemical Mechanical Polishing App 20140222188 - Duboust; Alain ; et al.	2014-08-07
Endpoint control of multiple substrates of varying thickness on the same platen in chemical mechanical polishing Grant 8,694,144 - Duboust , et al. April 8, 2	2014-04-08
Method of making and apparatus having windowless polishing pad and protected fiber Grant 8,465,342 - Zhang , et al. June 18, 2	2013-06-18
Method of Making and Apparatus Having Windowless Polishing Pad and Protected Fiber App 20120258649 - Zhang; Jimin ; et al.	2012-10-11
Substrate Carrier With Multiple Emissivity Coefficients For Thin Film Processing App 20120227667 - HUANG; Juno Yu-Ting ; et al.	2012-09-13
Epitaxial Growth Temperature Control In Led Manufacture App 20120118225 - HSU; Wei-Yung ; et al.	2012-05-17
Transfer Chamber Metrology For Improved Device Yield App 20120118224 - Bour; David P. ; et al.	2012-05-17
Apparatus Having Improved Substrate Temperature Uniformity Using Direct Heating Methods App 20120108081 - OLGADO; Donald J.K. ; et al.	2012-05-03
Method of making and apparatus having windowless polishing pad and protected fiber Grant 8,157,614 - Zhang , et al. April 17, 2	2012-04-17
Endpoint Control Of Multiple Substrates Of Varying Thickness On The Same Platen In Chemical Mechanical Polishing App 20120053717 - Duboust; Alain ; et al.	2012-03-01
Multi-layer polishing pad for low-pressure polishing Grant 8,066,552 - Duboust , et al. November 29, 2	2011-11-29
Method And Apparatus For Local Polishing Control App 20110053465 - TSAI; STAN ; et al.	2011-03-03
Method and apparatus for local polishing control Grant 7,842,169 - Tsai , et al. November 30, 2	2010-11-30
Method Of Making And Apparatus Having Windowless Polishing Pad And Protected Fiber App 20100279585 - Zhang; Jimin ; et al.	2010-11-04
Polishing Pad With Projecting Portion App 20100267318 - Duboust; Alain ; et al.	2010-10-21
Endpoint for electroprocessing Grant 7,790,015 - Wang , et al. September 7, 2	2010-09-07
Slurry Composition For Gst Phase Change Memory Materials Polishing App 20100130013 - Liu; Feng Q. ; et al.	2010-05-27
Electroprocessing profile control Grant 7,709,382 - Manens , et al. May 4, 2	2010-05-04
Method and apparatus for electrochemical mechanical processing Grant 7,678,245 - Wang , et al. March 16, 2	2010-03-16
Electroprocessing profile control Grant 7,655,565 - Manens , et al. February 2, 2	2010-02-02
Algorithm for real-time process control of electro-polishing Grant 7,628,905 - Manens , et al. December 8, 2	2009-12-08
Biased retaining ring Grant 7,608,173 - Manens , et al. October 27, 2	2009-10-27
Grooved retaining ring Grant 7,520,795 - Wang , et al. April 21, 2	2009-04-21
Conductive Polishing Article For Electrochemical Mechanical Polishing App 20090088050 - HSU; WEI-YUNG ; et al.	2009-04-02
Edge Bead Removal Process With Ecmp Technology App 20090061617 - Duboust; Alain ; et al.	2009-03-05
Ecmp Polishing Sequence To Improve Planarity And Defect Performance App 20090061741 - Wang; Zhihong ; et al.	2009-03-05
Method And Pad Design For The Removal Of Barrier Material By Electrochemical Mechanical Processing App 20080277787 - Liu; Feng Q. ; et al.	2008-11-13
Conductive polishing article for electrochemical mechanical polishing Grant 7,422,516 - Butterfield , et al. September 9, 2	2008-09-09
Method and composition for electrochemical mechanical polishing processing Grant 7,390,429 - Liu , et al. June 24, 2	2008-06-24
Conductive Polishing Article for Electrochemical Mechanical Polishing App 20080108288 - Hu; Yongqi ; et al.	2008-05-08
Conductive pad with ion exchange membrane for electrochemical mechanical polishing Grant 7,344,432 - Chen , et al. March 18, 2	2008-03-18
Electroprocessing Profile Control App 20080047841 - MANENS; ANTOINE P. ; et al.	2008-02-28
Endpoint For Electroprocessing App 20080051009 - Wang; Yan ; et al.	2008-02-28
Electroprocessing Profile Control App 20080045012 - Manens; Antoine P. ; et al.	2008-02-21
Retaining Ring With Conductive Portion App 20080038999 - Manens; Antoine P. ; et al.	2008-02-14
Conductive Polishing Article For Electrochemical Mechanical Polishing App 20080026681 - BUTTERFIELD; PAUL D. ; et al.	2008-01-31
Method and composition for polishing a substrate Grant 7,323,416 - Liu , et al. January 29, 2	2008-01-29
System And Method For In-situ Head Rinse App 20080003931 - Manens; Antoine P. ; et al.	2008-01-03
Method And Composition For Polishing A Substrate App 20070295611 - LIU; FENG Q. ; et al.	2007-12-27
Conductive polishing article for electrochemical mechanical polishing Grant 7,311,592 - Chen , et al. December 25, 2	2007-12-25
Method And Composition For Polishing A Substrate App 20070290166 - Liu; Feng Q. ; et al.	2007-12-20
Edge bead removal by an electro polishing process Grant 7,303,462 - Duboust , et al. December 4, 2	2007-12-04
Method and apparatus for electrochemical mechanical polishing of cu with higher liner velocity for better surface finish and higher removal rate during clearance App 20070251832 - Du; Tianbao ; et al.	2007-11-01
Pad assembly for electrochemical mechanical polishing Grant 7,285,036 - Chang , et al. October 23, 2	2007-10-23
Planarization of substrates at a high polishing rate using electrochemical mechanical polishing App 20070243709 - Duboust; Alain ; et al.	2007-10-18
Conductive polishing article for electrochemical mechanical polishing Grant 7,278,911 - Butterfield , et al. October 9, 2	2007-10-09
Removal profile tuning by adjusting conditioning sweep profile on a conductive pad App 20070227902 - Du; Tianbao ; et al.	2007-10-04
Retaining ring with conductive portion Grant 7,276,743 - Manens , et al. October 2, 2	2007-10-02
Novel rinse solution to remove cross-contamination App 20070219103 - Du; Tianbao ; et al.	2007-09-20
Methods and apparatus for electroprocessing with recessed bias contact App 20070215488 - Wang; Yan ; et al.	2007-09-20
Method for electrochemically polishing a conductive material on a substrate App 20070187258 - Du; Tianbao ; et al.	2007-08-16
Electrochemical processing with dynamic process control App 20070158201 - Kollata; Eashwer ; et al.	2007-07-12
Method and composition for polishing a substrate Grant 7,232,514 - Liu , et al. June 19, 2	2007-06-19
Hydrogen bubble reduction on the cathode using double-cell designs Grant 7,229,535 - Wang , et al. June 12, 2	2007-06-12
Pad Assembly For Electrochemical Mechanical Polishing App 20070111638 - CHANG; SHOU-SUNG ; et al.	2007-05-17
Ball Contact Cover For Copper Loss Reduction And Spike Reduction App 20070096315 - Manens; Antoine P. ; et al.	2007-05-03
Conductive Pad With Ion Exchange Membrane For Electrochemical Mechanical Polishing App 20070099552 - Chen; Liang-Yuh ; et al.	2007-05-03
Conductive polishing article for electrochemical mechanical polishing Grant 7,207,878 - Hu , et al. April 24, 2	2007-04-24
Contact assembly cleaning in an electrochemical mechanical processing apparatus App 20070084729 - Manens; Antoine P. ; et al.	2007-04-19
Conductive Polishing Article For Electrochemical Mechanical Polishing App 20070066201 - Chen; Liang-Yuh ; et al.	2007-03-22
Perforation and grooving for polishing articles App 20070066200 - Li; Shijian ; et al.	2007-03-22
Grooved Retaining Ring App 20070044913 - Wang; Shi-Ping ; et al.	2007-03-01
Method and composition for polishing a substrate Grant 7,160,432 - Liu , et al. January 9, 2	2007-01-09
Pad assembly for electrochemical mechanical processing Grant 7,137,868 - Chang , et al. November 21, 2	2006-11-21
Conductive polishing article for electrochemical mechanical polishing Grant 7,137,879 - Chen , et al. November 21, 2	2006-11-21
Method and composition for polishing a substrate Grant 7,128,825 - Liu , et al. October 31, 2	2006-10-31
Algorithm for real-time process control of electro-polishing App 20060237330 - Manens; Antoine P. ; et al.	2006-10-26
Metal CMP process on one or more polishing stations using slurries with oxidizers App 20060219663 - Wang; Shi-Ping ; et al.	2006-10-05
Perforation and grooving for polishing articles App 20060217049 - Li; Shijian ; et al.	2006-09-28
Algorithm for real-time process control of electro-polishing Grant 7,112,270 - Manens , et al. September 26, 2	2006-09-26
Conductive polishing article for electrochemical mechanical polishing App 20060172671 - Chen; Liang-Yuh ; et al.	2006-08-03
Method and composition for polishing a substrate App 20060169597 - Liu; Feng Q. ; et al.	2006-08-03
Algorithm For Real-time Process Control Of Electro-polishing App 20060163074 - Manens; Antoine P. ; et al.	2006-07-27
Electroprocessing profile control App 20060166500 - Manens; Antoine P. ; et al.	2006-07-27
Pad assembly for electrochemical mechanical processing App 20060148381 - Chang; Shou-Sung ; et al.	2006-07-06
Biased retaining ring App 20060137819 - Manens; Antoine P. ; et al.	2006-06-29
Conductive polishing article for electrochemical mechanical polishing Grant 7,066,800 - Chen , et al. June 27, 2	2006-06-27
Method and apparatus for local polishing control App 20060124474 - Tsai; Stan ; et al.	2006-06-15
Articles for polishing semiconductor substrates Grant 7,059,948 - Li , et al. June 13, 2	2006-06-13
Method and composition for electrochemical mechanical polishing processing App 20060102872 - Liu; Feng Q. ; et al.	2006-05-18
Pad assembly for electrochemical mechanical processing Grant 7,029,365 - Chang , et al. April 18, 2	2006-04-18
Conductive polishing article for electrochemical mechanical polishing Grant 6,991,528 - Hu , et al. January 31, 2	2006-01-31
Control of removal profile in electrochemically assisted CMP Grant 6,991,526 - Sun , et al. January 31, 2	2006-01-31
Conductive polishing article for electrochemical mechanical polishing Grant 6,988,942 - Chen , et al. January 24, 2	2006-01-24
Method and composition for polishing a substrate App 20060006074 - Liu; Feng Q. ; et al.	2006-01-12
Conductive polishing article for electrochemical mechanical polishing App 20050284770 - Butterfield, Paul D. ; et al.	2005-12-29
Conductive polishing article for electrochemical mechanical polishing Grant 6,979,248 - Hu , et al. December 27, 2	2005-12-27
Retaining ring with conductive portion App 20050282322 - Manens, Antoine P. ; et al.	2005-12-22
Method and apparatus for substrate polishing Grant 6,977,036 - Wadensweiler , et al. December 20, 2	2005-12-20
Conductive polishing article for electrochemical mechanical polishing Grant 6,962,524 - Butterfield , et al. November 8, 2	2005-11-08
Multi-layer polishing pad for low-pressure polishing App 20050221723 - Duboust, Alain ; et al.	2005-10-06
Edge bead removal by an electro polishing process App 20050161341 - Duboust, Alain ; et al.	2005-07-28
Conductive polishing article for electrochemical mechanical polishing App 20050133363 - Hu, Yongqi ; et al.	2005-06-23
Electrolyte composition and treatment for electrolytic chemical mechanical polishing Grant 6,899,804 - Duboust , et al. May 31, 2	2005-05-31
Methods and apparatus for polishing a substrate App 20050092620 - Mavliev, Rashid A. ; et al.	2005-05-05
Endpoint compensation in electroprocessing App 20050061674 - Wang, Yan ; et al.	2005-03-24
Planarization of substrates using electrochemical mechanical polishing App 20050056537 - Chen, Liang-Yuh ; et al.	2005-03-17
Method and apparatus for substrate polishing Grant 6,841,057 - Wadensweiler , et al. January 11, 2	2005-01-11
Method and apparatus for electrochemical mechanical processing App 20050000801 - Wang, Yan ; et al.	2005-01-06
Endpoint detection for electro chemical mechanical polishing and electropolishing processes Grant 6,837,983 - Duboust , et al. January 4, 2	2005-01-04
Conductive polishing article for electrochemical mechanical polishing App 20040266327 - Chen, Liang-Yuh ; et al.	2004-12-30
Planarization of substrates using electrochemical mechanical polishing Grant 6,811,680 - Chen , et al. November 2, 2	2004-11-02
Method and apparatus for substrate polishing App 20040200733 - Wadensweiler, Ralph ; et al.	2004-10-14
Method and apparatus for local polishing control App 20040173461 - Tsai, Stan ; et al.	2004-09-09
Pad assembly for electrochemical mechanical processing App 20040163946 - Chang, Shou-Sung ; et al.	2004-08-26
Method and apparatus for face-up substrate polishing Grant 6,776,693 - Duboust , et al. August 17, 2	2004-08-17
Apparatus and method for fast-cycle atomic layer deposition Grant 6,773,507 - Jallepally , et al. August 10, 2	2004-08-10
Conductive polishing article for electrochemical mechanical polishing App 20040082289 - Butterfield, Paul D. ; et al.	2004-04-29
Control of removal profile in electrochemically assisted CMP App 20040053560 - Sun, Lizhong ; et al.	2004-03-18
Method and composition for polishing a substrate App 20040053499 - Liu, Feng Q. ; et al.	2004-03-18
Conductive polishing article for electrochemical mechanical polishing App 20040023610 - Hu, Yongqi ; et al.	2004-02-05
Conductive polishing article for electrochemical mechanical polishing App 20040020789 - Hu, Yongqi ; et al.	2004-02-05
Method and composition for polishing a substrate App 20030234184 - Liu, Feng Q. ; et al.	2003-12-25
Method and apparatus for substrate polishing App 20030213703 - Wang, Yan ; et al.	2003-11-20
Hydrogen bubble reduction on the cathode using double-cell designs App 20030216045 - Wang, Yan ; et al.	2003-11-20
Conductive polishing article for electrochemical mechanical polishing App 20030209448 - Hu, Yongqi ; et al.	2003-11-13
Method and composition for polishing a substrate App 20030178320 - Liu, Feng Q. ; et al.	2003-09-25
Method and apparatus for substrate polishing App 20030173230 - Wadensweiler, Ralph ; et al.	2003-09-18
Endpoint detection for electro chemical mechanical polishing and electropolishing processes App 20030136684 - Duboust, Alain ; et al.	2003-07-24
Electrolyte composition and treatment for electrolytic chemical mechanical polishing App 20030116446 - Duboust, Alain ; et al.	2003-06-26
Method and apparatus for face-up substrate polishing App 20030114087 - Duboust, Alain ; et al.	2003-06-19
Apparatus and method for fast-cycle atomic layer deposition App 20030106490 - Jallepally, Ravi ; et al.	2003-06-12
Gas jet deposition with multiple ports App 20020197416 - Majewski, Robert B. ; et al.	2002-12-26
Planarization of substrates using electrochemical mechanical polishing App 20020130049 - Chen, Liang-Yuh ; et al.	2002-09-19
Conductive polishing article for electrochemical mechanical polishing App 20020119286 - Chen, Liang-Yuh ; et al.	2002-08-29
Articles for polishing semiconductor substrates App 20020102853 - Li, Shijian ; et al.	2002-08-01

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