Dubois; Geraud

Patent Applications and Registrations

Patent applications and USPTO patent grants for Dubois; Geraud.The latest application filed is for "enhanced via fill material and processing for dual damascene integration".

Company Profile

2.7.7

Dubois; Geraud - Armonk NY
Dubois; Geraud - Los Gatos CA US
Dubois; Geraud - Dijon FR
Dubois; Geraud - Palo Alto CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Enhanced via fill material and processing for dual damscene integration Grant 10,340,182 - Doyle , et al.	2019-07-02
Enhanced Via Fill Material And Processing For Dual Damascene Integration App 20180138084 - Doyle; James P. ; et al.	2018-05-17
Enhanced Via Fill Material And Processing For Dual Damscene Integration App 20170154812 - DOYLE; James P. ; et al.	2017-06-01
Methods to mitigate plasma damage in organosilicate dielectrics Grant 8,481,423 - Arnold , et al. July 9, 2	2013-07-09
Methods to mitigate plasma damage in organosilicate dielectrics Grant 8,470,706 - Arnold , et al. June 25, 2	2013-06-25
Methods To Mitigate Plasma Damage In Organosilicate Dielectrics App 20120329269 - Arnold; John C. ; et al.	2012-12-27
Materials for selective trapping of carbon monoxide Grant 8,247,392 - Jerome , et al. August 21, 2	2012-08-21
Methods To Mitigate Plasma Damage In Organosilicate Dielectrics App 20090075472 - Arnold; John C. ; et al.	2009-03-19
Methods to form SiCOH or SiCNH dielectrics and structures including the same App 20080009141 - Dubois; Geraud ; et al.	2008-01-10
Porous organosilicates with improved mechanical properties Grant 7,229,934 - Dubois , et al. June 12, 2	2007-06-12
Novel materials for selective trapping of carbon minixide App 20060287195 - Jerome; Francois ; et al.	2006-12-21
Porous organosilicates with improved mechanical properties App 20060084282 - Dubois; Geraud ; et al.	2006-04-20

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