DUBIN; Valery M.

Patent Applications and Registrations

Patent applications and USPTO patent grants for DUBIN; Valery M..The latest application filed is for "designs and methods for conductive bumps".

Company Profile

2.94.112

DUBIN; Valery M. - Portland OR
Dubin; Valery M. - Beaverton OR
Dubin; Valery M. - Portlan OR
Dubin; Valery M - Portland OR
Dubin; Valery M. - Cupertino CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Designs And Methods For Conductive Bumps App 20220059484 - DUBIN; Valery M. ; et al.	2022-02-24
Designs and methods for conductive bumps Grant 11,201,129 - Dubin , et al. December 14, 2	2021-12-14
Designs And Methods For Conductive Bumps App 20190198472 - DUBIN; Valery M. ; et al.	2019-06-27
Designs and methods for conductive bumps Grant 10,249,588 - Dubin , et al.	2019-04-02
Wafer with gel-based biochips for electrochemical synthesis and electrical detection of polymers Grant 10,035,147 - Dubin , et al. July 31, 2	2018-07-31
Designs And Methods For Conductive Bumps App 20170084564 - DUBIN; Valery M. ; et al.	2017-03-23
Designs and methods for conductive bumps Grant 9,543,261 - Dubin , et al. January 10, 2	2017-01-10
Microelectronic package having direct contact heat spreader and method of manufacturing same Grant 9,508,675 - Lu , et al. November 29, 2	2016-11-29
Gel-based Bio Chip For Electrochemical Synthesis And Electrical Detection Of Polymers App 20150231633 - Dubin; Valery M. ; et al.	2015-08-20
Method and apparatus to fabricate polymer arrays on patterned wafers using electrochemical synthesis Grant 9,085,461 - Dubin , et al. July 21, 2	2015-07-21
Methods For Electroplating Copper App 20150096894 - Dubin; Valery M. ; et al.	2015-04-09
Gel-based bio chip for electrochemical synthesis and electrical detection of polymers Grant 8,940,143 - Dubin , et al. January 27, 2	2015-01-27
Methods for electroplating copper Grant 8,911,609 - Dubin , et al. December 16, 2	2014-12-16
Microelectronic Package Having Direct Contact Heat Spreader And Method Of Manufacturing Same App 20130344659 - Lu; Daoqiang ; et al.	2013-12-26
Designs and methods for conductive bumps Grant 8,580,679 - Dubin , et al. November 12, 2	2013-11-12
Microelectronic package having direct contact heat spreader and method of manufacturing same Grant 8,541,876 - Lu , et al. September 24, 2	2013-09-24
Tunable gate electrode work function material for transistor applications Grant 8,319,287 - Lavoie , et al. November 27, 2	2012-11-27
Method and apparatus to fabricate polymer arrays on patterned wafers using electrochemical synthesis Grant 8,278,121 - Dubin , et al. October 2, 2	2012-10-02
Method And Apparatus To Fabricate Polymer Arrays On Patterned Wafers Using Electrochemical Synthesis App 20120225512 - Dubin; Valery M. ; et al.	2012-09-06
Methods For Electroplating Copper App 20120199491 - Dubin; Valery M. ; et al.	2012-08-09
Forming a copper diffusion barrier Grant 8,227,335 - Johnston , et al. July 24, 2	2012-07-24
Method And Apparatus To Fabricate Polymer Arrays On Patterned Wafers Using Electrochemical Synthesis App 20120070930 - DuBin; Valery M. ; et al.	2012-03-22
Method and apparatus to fabricate polymer arrays on patterned wafers using electrochemical synthesis Grant 8,053,774 - Dubin , et al. November 8, 2	2011-11-08
Nanotube growth and device formation Grant 7,964,174 - Dubin , et al. June 21, 2	2011-06-21
Designs And Methods For Conductive Bumps App 20110084387 - Dubin; Valery M. ; et al.	2011-04-14
Substrate holder and electroplating system Grant 7,905,994 - Dubin , et al. March 15, 2	2011-03-15
Packaging of integrated circuits with carbon nanotube arrays to enhance heat dissipation through a thermal interface Grant 7,847,394 - Dubin , et al. December 7, 2	2010-12-07
Polymer Memory And Method Of Its Fabrication App 20100195267 - Dubin; Valery M. ; et al.	2010-08-05
Forming self-aligned nano-electrodes Grant 7,755,082 - Dubin , et al. July 13, 2	2010-07-13
Tunable Gate Electrode Work Function Material For Transistor Applications App 20100140717 - Lavoie; Adrien R. ; et al.	2010-06-10
Polymer memory with adhesion layer containing an immobilized metal Grant 7,709,873 - Dubin , et al. May 4, 2	2010-05-04
Packaging of integrated circuits with carbon nano-tube arrays to enhance heat dissipation through a thermal interface Grant 7,704,791 - Dubin , et al. April 27, 2	2010-04-27
Tunable gate electrode work function material for transistor applications Grant 7,682,891 - Lavoie , et al. March 23, 2	2010-03-23
Carbon Nanotube Interconnect Structures App 20100022083 - Gstrein; Florian ; et al.	2010-01-28
Composite metal films and carbon nanotube fabrication Grant 7,635,503 - Dominguez , et al. December 22, 2	2009-12-22
Method to assemble structures from nano-materials Grant 7,633,080 - Dubin December 15, 2	2009-12-15
Conformal electroless deposition of barrier layer materials Grant 7,629,252 - O'Brien , et al. December 8, 2	2009-12-08
Method for an improved air gap interconnect structure Grant 7,629,268 - Dubin , et al. December 8, 2	2009-12-08
Method of fabricating a carbon nanotube interconnect structures Grant 7,625,817 - Gstrein , et al. December 1, 2	2009-12-01
Method To Assemble Structures From Nano-materials App 20090278257 - Dubin; Valery M.	2009-11-12
Methods for electroplating copper App 20090250352 - Dubin; Valery M. ; et al.	2009-10-08
Electroless plating systems and methods Grant 7,597,763 - Dubin , et al. October 6, 2	2009-10-06
Methods of fabricating a composite carbon nanotube thermal interface device App 20090224422 - Dubin; Valery M.	2009-09-10
Apparatus for an improved air gap interconnect structure Grant 7,586,196 - Dubin , et al. September 8, 2	2009-09-08
Methods of fabricating solar-cell structures and resulting solar-cell structures App 20090188553 - Dubin; Valery M.	2009-07-30
Amine-free deposition of metal-nitride films Grant 7,550,385 - Lavoie , et al. June 23, 2	2009-06-23
Protection of seedlayer for electroplating App 20090117733 - Dubin; Valery M. ; et al.	2009-05-07
Protection of seedlayer for electroplating Grant 7,525,196 - Dubin , et al. April 28, 2	2009-04-28
Substrate holder and electroplating system App 20090090631 - Dubin; Valery M. ; et al.	2009-04-09
Electroplating aqueous solution and method of making and using same App 20090038947 - Dubin; Valery M. ; et al.	2009-02-12
Method to fabricate interconnect structures Grant 7,476,974 - Andreyushchenko , et al. January 13, 2	2009-01-13
Composite carbon nanotube thermal interface device Grant 7,476,967 - Dubin January 13, 2	2009-01-13
Electrochemical Synthesis And Electrical Detection Of Polymers With Gel-based Bio Chip App 20090000957 - Dubin; Valery M. ; et al.	2009-01-01
Microcircuit fabrication and interconnection Grant 7,470,620 - Dubin , et al. December 30, 2	2008-12-30
Nanotube Growth And Device Formation App 20080311400 - Dubin; Valery M. ; et al.	2008-12-18
Copper nucleation in interconnects having ruthenium layers App 20080296768 - Chebiam; Ramanan V. ; et al.	2008-12-04
Method for constructing contact formations Grant 7,442,634 - Dubin , et al. October 28, 2	2008-10-28
Designs and methods for conductive bumps App 20080213996 - Dubin; Valery M. ; et al.	2008-09-04
Tunable gate electrode work function material for transistor applications App 20080157212 - Lavoie; Adrien R. ; et al.	2008-07-03
Microcircuit Fabrication And Interconnection App 20080119016 - Dubin; Valery M. ; et al.	2008-05-22
Forming self-aligned nano-electrodes App 20080116439 - Dubin; Valery M. ; et al.	2008-05-22
Method of fabricating metal interconnects using a sacrificial layer to protect seed layer prior to gap fill App 20080113508 - Akolkar; Rohan N. ; et al.	2008-05-15
Modified electroplating solution components in a low-acid electrolyte solution Grant 7,371,311 - Zierath , et al. May 13, 2	2008-05-13
Method for making a semiconductor device having increased conductive material reliability Grant 7,372,165 - Dubin , et al. May 13, 2	2008-05-13
Catalytic nucleation monolayer for metal seed layers Grant 7,365,011 - Lavoie , et al. April 29, 2	2008-04-29
Microcircuit fabrication and interconnection Grant 7,348,675 - Dubin , et al. March 25, 2	2008-03-25
Electroplating chemistries and methods of forming interconnections Grant 7,338,585 - Akolkar , et al. March 4, 2	2008-03-04
Method for an improved air gap interconnect structure App 20080044999 - Dubin; Valery M. ; et al.	2008-02-21
Sacrificial tapered trench opening for damascene interconnects App 20080026555 - Dubin; Valery M. ; et al.	2008-01-31
Packaging of integrated circuits with carbon nano-tube arrays to enhance heat dissipation through a thermal interface Grant 7,316,061 - Dubin , et al. January 8, 2	2008-01-08
Method of forming a conducting layer on a conducting and non-conducting substrate App 20080003366 - Dubin; Valery M. ; et al.	2008-01-03
Packaging of integrated circuits with carbon nano-tube arrays to enhance heat dissipation through a thermal interface App 20080003801 - Dubin; Valery M. ; et al.	2008-01-03
Tin deposition Grant 7,314,543 - Fang , et al. January 1, 2	2008-01-01
Forming a copper diffusion barrier App 20070298608 - Johnston; Steven W. ; et al.	2007-12-27
Forming self-aligned nano-electrodes Grant 7,312,155 - Dubin , et al. December 25, 2	2007-12-25
Method and CMOS-based device to analyze molecules and nanomaterials based on the electrical readout of specific binding events on functionalized electrodes App 20070292855 - Dubin; Valery M. ; et al.	2007-12-20
Apparatus for an improved air gap interconnect structure App 20070284744 - Dubin; Valery M. ; et al.	2007-12-13
Methods for forming thin copper films and structures formed thereby App 20070281476 - Lavoie; Adrien R. ; et al.	2007-12-06
Method and apparatus for an improved air gap interconnect structure Grant 7,304,388 - Dubin , et al. December 4, 2	2007-12-04
Integrated circuit with metal layer having carbon nanotubes and methods of making same Grant 7,300,860 - Dubin November 27, 2	2007-11-27
Electroplating Chemistries and Methods of Forming Interconnections App 20070267297 - Akolkar; Rohan N. ; et al.	2007-11-22
Formation of high metallic content carbon nanotube structures App 20070248794 - Gstrein; Florian ; et al.	2007-10-25
Multiple stage electroless deposition of a metal layer Grant 7,285,494 - Cheng , et al. October 23, 2	2007-10-23
Forming a copper diffusion barrier Grant 7,279,423 - Johnston , et al. October 9, 2	2007-10-09
Electroless plating structure Grant 7,279,231 - Chebiam , et al. October 9, 2	2007-10-09
Designs and methods for conductive bumps Grant 7,276,801 - Dubin , et al. October 2, 2	2007-10-02
Multiple stage electroless deposition of a metal layer Grant 7,262,504 - Cheng , et al. August 28, 2	2007-08-28
Composite metal films and carbon nanotube fabrication App 20070196575 - Dominguez; Juan E. ; et al.	2007-08-23
Carbon nanotubes with controlled diameter, length, and metallic contacts Grant 7,250,366 - Dubin July 31, 2	2007-07-31
Carbon nanotube interconnect structures App 20070155158 - Gstrein; Florian ; et al.	2007-07-05
Conformal electroless deposition of barrier layer materials App 20070148952 - O'Brien; Kevin P. ; et al.	2007-06-28
Method for making a semiconductor device having increased conductive material reliability Grant 7,229,922 - Dubin , et al. June 12, 2	2007-06-12
Methods to deposit metal alloy barrier layers Grant 7,223,695 - Zhong , et al. May 29, 2	2007-05-29
Method for improving selectivity of electroless metal deposition Grant 7,223,694 - Cheng , et al. May 29, 2	2007-05-29
Catalytic nucleation monolayer for metal seed layers App 20070105375 - Lavoie; Adrien R. ; et al.	2007-05-10
Methods of fabricating a composite carbon nanotube thermal interface device App 20070102809 - Dubin; Valery M.	2007-05-10
Metal oxide sensors and method of forming Grant 7,208,327 - Gstrein , et al. April 24, 2	2007-04-24
Microelectronic package having direct contact heat spreader and method of manufacturing same App 20070075420 - Lu; Daoqiang ; et al.	2007-04-05
Amine-free deposition of metal-nitride films App 20070075427 - Lavoie; Adrien R. ; et al.	2007-04-05
Forming dual metal complementary metal oxide semiconductor integrated circuits Grant 7,192,856 - Doczy , et al. March 20, 2	2007-03-20
Damascene process for fabricating interconnect layers in an integrated circuit Grant 7,157,380 - Dubin , et al. January 2, 2	2007-01-02
Electroosmotic pump apparatus that generates low amount of hydrogen gas Grant 7,149,085 - Chebiam , et al. December 12, 2	2006-12-12
Method and apparatus to fabricate polymer arrays on patterned wafers using electrochemical synthesis App 20060275927 - Dubin; Valery M. ; et al.	2006-12-07
Metal oxide sensors and method of forming App 20060267051 - Gstrein; Florian ; et al.	2006-11-30
Enhancement of an interconnect Grant 7,135,775 - Chambers , et al. November 14, 2	2006-11-14
Method to assemble structures from nano-materials Grant 7,122,461 - Dubin October 17, 2	2006-10-17
Method of fabricating a composite carbon nanotube thermal interface device Grant 7,118,941 - Zhang , et al. October 10, 2	2006-10-10
Polymer memory and method of its fabrication App 20060220080 - Dubin; Valery M. ; et al.	2006-10-05
Packaging of integrated circuits with carbon nanotube arrays to enhance heat dissipation through a thermal interface App 20060222852 - Dubin; Valery M. ; et al.	2006-10-05
Methods of fabricating a composite carbon nanotube thermal interface device Grant 7,112,472 - Dubin September 26, 2	2006-09-26
Carbon nanotubes with controlled diameter, length, and metallic contacts App 20060208362 - Dubin; Valery M.	2006-09-21
Method to fabricate interconnect structures App 20060202342 - Andreyushchenko; Tatyana N. ; et al.	2006-09-14
Nanotubes for integrated circuits Grant 7,105,851 - Dubin September 12, 2	2006-09-12
Method To Assemble Structures From Nano-materials App 20060177946 - Dubin; Valery M.	2006-08-10
Method to fabricate interconnect structures Grant 7,087,517 - Andreyushchenko , et al. August 8, 2	2006-08-08
Forming dual metal complementary metal oxide semiconductor integrated circuits App 20060160342 - Doczy; Mark ; et al.	2006-07-20
Protection of seedlayer for electroplating App 20060131750 - Dubin; Valery M. ; et al.	2006-06-22
Method for constructing contact formations App 20060134902 - Dubin; Valery M. ; et al.	2006-06-22
Method of protecting a seed layer for electroplating Grant 7,060,617 - Dubin , et al. June 13, 2	2006-06-13
Multiple stage electroless deposition of a metal layer Grant 7,049,234 - Cheng , et al. May 23, 2	2006-05-23
Methods to deposit metal alloy barrier layers App 20060071340 - Zhong; Ting ; et al.	2006-04-06
Method to fabricate copper-cobalt interconnects App 20060063382 - Dubin; Valery M. ; et al.	2006-03-23
Use of conductive electrolessly deposited etch stop layers, liner layers and via plugs in interconnect structures Grant 7,008,872 - Dubin , et al. March 7, 2	2006-03-07
Electroosmotic pump apparatus that generates low amount of hydrogen gas App 20060044759 - Chebiam; Ramanan V. ; et al.	2006-03-02
Seed layer treatment Grant 7,001,641 - Dubin , et al. February 21, 2	2006-02-21
Method of electroless introduction of interconnect structures Grant 6,977,224 - Dubin , et al. December 20, 2	2005-12-20
Compliant interconnect and method of formation App 20050277281 - Dubin, Valery M. ; et al.	2005-12-15
Modified electroplating solution components in a low-acid electrolyte solution App 20050274619 - Zierath, Daniel J. ; et al.	2005-12-15
Multiple stage electroless deposition of a metal layer App 20050266265 - Cheng, Chin-Chang ; et al.	2005-12-01
Multiple stage electroless deposition of a metal layer App 20050260339 - Cheng, Chin-Chang ; et al.	2005-11-24
Interconnect structures containing conductive electrolessly deposited etch stop layers, liner layers, and via plugs Grant 6,958,547 - Dubin , et al. October 25, 2	2005-10-25
Methods for forming interconnect structures by co-plating of noble metals and structures formed thereby App 20050230263 - Dubin, Valery M.	2005-10-20
Forming self-aligned nano-electrodes App 20050224778 - Dubin, Valery M. ; et al.	2005-10-13
Integrated circuit with metal layer having carbon nanotubes and methods of making same App 20050218523 - Dubin, Valery M.	2005-10-06
Sensor array integrated circuits App 20050221473 - Dubin, Valery M. ; et al.	2005-10-06
Microcircuit fabrication and interconnection Grant 6,933,222 - Dubin , et al. August 23, 2	2005-08-23
Microcircuit fabrication and interconnection App 20050167755 - Dubin, Valery M. ; et al.	2005-08-04
Electroless plating systems and methods App 20050163916 - Dubin, Valery M. ; et al.	2005-07-28
Method for making a semiconductor device having increased conductive material reliability App 20050161828 - Dubin, Valery M. ; et al.	2005-07-28
Method of sorting carbon nanotubes including protecting metallic nanotubes and removing the semiconducting nanotubes Grant 6,921,684 - Dubin July 26, 2	2005-07-26
Nanotube growth and device formation App 20050147746 - Dubin, Valery M. ; et al.	2005-07-07
Method to fabricate interconnect structures App 20050146034 - Andreyushchenko, Tatyana N. ; et al.	2005-07-07
Damascene process for fabricating interconnect layers in an integrated circuit App 20050148190 - Dubin, Valery M. ; et al.	2005-07-07
Damascene interconnect structures App 20050146048 - Dubin, Valery M. ; et al.	2005-07-07
Method to fabricate amorphous electroless metal layers App 20050147762 - Dubin, Valery M. ; et al.	2005-07-07
Multiple stage electroless deposition of a metal layer App 20050136654 - Cheng, Chin-Chang ; et al.	2005-06-23
Electroless plating bath composition and method of using Grant 6,908,504 - Chebiam , et al. June 21, 2	2005-06-21
Seed layer treatment App 20050112856 - Dubin, Valery M. ; et al.	2005-05-26
Method Of Sorting Carbon Nanotubes Including Protecting Metallic Nanotubes And Removing The Semiconducting Nanotubes App 20050106846 - Dubin, Valery M.	2005-05-19
Method for making a semiconductor device having increased conductive material reliability App 20050090098 - Dubin, Valery M. ; et al.	2005-04-28
Modified electroplating solution components in a high-acid electrolyte solution App 20050077180 - Zierath, Daniel J. ; et al.	2005-04-14
Modified electroplating solution components in a low-acid electrolyte solution App 20050077181 - Zierath, Daniel J. ; et al.	2005-04-14
Tin deposition App 20050077082 - Fang, Ming ; et al.	2005-04-14
Designs and methods for conductive bumps App 20050062169 - Dubin, Valery M. ; et al.	2005-03-24
Nanotubes for integrated circuits App 20050062034 - Dubin, Valery M.	2005-03-24
Apparatus and method for electroless spray deposition Grant 6,843,852 - Dubin , et al. January 18, 2	2005-01-18
Apparatus and method for electroless spray deposition App 20050008786 - Dubin, Valery M. ; et al.	2005-01-13
Dopant interface formation Grant 6,841,458 - Dubin , et al. January 11, 2	2005-01-11
Methods of fabricating a composite carbon nanotube thermal interface device App 20040265489 - Dubin, Valery M.	2004-12-30
Method and apparatus for an improved air gap interconnect structure App 20040266167 - Dubin, Valery M. ; et al.	2004-12-30
Method of fabricating a composite carbon nanotube thermal interface device App 20040266065 - Zhang, Yuegang ; et al.	2004-12-30
Method for improving selectivity of electroless metal deposition App 20040253814 - Cheng, Chin-Chang ; et al.	2004-12-16
Microcircuit fabrication and interconnection App 20040253805 - Dubin, Valery M. ; et al.	2004-12-16
Method for forming electroless metal low resistivity interconnects App 20040248403 - Dubin, Valery M. ; et al.	2004-12-09
Dopant interface formation Grant 6,828,613 - Dubin , et al. December 7, 2	2004-12-07
Packaging of integrated circuits with carbon nano-tube arrays to enhance heat dissipation through a thermal interface App 20040150100 - Dubin, Valery M. ; et al.	2004-08-05
Methods for forming copper interconnect structures by co-plating of noble metals and structures formed thereby App 20040108217 - Dubin, Valery M.	2004-06-10
Electroless cobalt plating solution and plating techniques App 20040096592 - Chebiam, Ramanan V. ; et al.	2004-05-20
Method of treating an electroless plating waste Grant 6,733,679 - Dubin , et al. May 11, 2	2004-05-11
Forming a copper diffusion barrier App 20040084773 - Johnston, Steven W. ; et al.	2004-05-06
Seed layer treatment App 20040058139 - Dubin, Valery M. ; et al.	2004-03-25
Dopant interface formation App 20040053441 - Dubin, Valery M. ; et al.	2004-03-18
Method of making oxide embedded transistor structures App 20040048437 - Dubin, Valery M.	2004-03-11
Electroless plating bath composition and method of using App 20040035316 - Chebiam, Ramanan V. ; et al.	2004-02-26
Electroless plating bath composition and method of using App 20040038073 - Chebiam, Ramanan V. ; et al.	2004-02-26
Interconnect structures and a method of electroless introduction of interconnect structures Grant 6,696,758 - Dubin , et al. February 24, 2	2004-02-24
Material deposition from a liquefied gas solution Grant 6,677,233 - Dubin January 13, 2	2004-01-13
Method of protecting a seed layer for electroplating App 20040000720 - Dubin, Valery M. ; et al.	2004-01-01
Electroless plating bath composition and method of using Grant 6,645,567 - Chebiam , et al. November 11, 2	2003-11-11
Interconnect structures containing conductive electrolessly deposited etch stop layers, liner layers, and via plugs App 20030207561 - Dubin, Valery M. ; et al.	2003-11-06
Use of conductive electrolessly deposited etch stop layers, liner layers and via plugs in interconnect structures App 20030207560 - Dubin, Valery M. ; et al.	2003-11-06
Enhancement of an interconnect App 20030137050 - Chambers, Stephen T. ; et al.	2003-07-24
Apparatus and method for electroless spray deposition App 20030134047 - Dubin, Valery M. ; et al.	2003-07-17
Material deposition from a liquefied gas solution App 20030124840 - Dubin, Valery M.	2003-07-03
Electroless plating bath composition and method of using App 20030113576 - Chebiam, Ramanan V. ; et al.	2003-06-19
Method of treating an electroless plating waste App 20030085177 - Dubin, Valery M. ; et al.	2003-05-08
Interconnect structures and a method of electroless introduction of interconnect structures App 20030071355 - Dubin, Valery M. ; et al.	2003-04-17
Method of copper electroplating Grant 6,432,821 - Dubin , et al. August 13, 2	2002-08-13
Interconnect structures and a method of electroless introduction of interconnect structures App 20020084529 - Dubin, Valery M. ; et al.	2002-07-04
Method Of Copper Electroplating App 20020074234 - Dubin, Valery M. ; et al.	2002-06-20
Electroless method of seed layer depostion, repair, and fabrication of Cu interconnects App 20020064592 - Datta, Madhav ; et al.	2002-05-30
Method for filling high aspect ratio openings of an integrated circuit to minimize electromigration failure Grant 6,077,780 - Dubin June 20, 2	2000-06-20
Via with barrier layer for impeding diffusion of conductive material from via into insulator Grant 6,001,415 - Nogami , et al. December 14, 1	1999-12-14
Electroless CU deposition on a barrier layer by CU contact displacement for ULSI applications Grant 5,891,513 - Dubin , et al. April 6, 1	1999-04-06
Electroless deposition equipment or apparatus and method of performing electroless deposition Grant 5,830,805 - Shacham-Diamand , et al. November 3, 1	1998-11-03
Protected encapsulation of catalytic layer for electroless copper interconnect Grant 5,824,599 - Schacham-Diamand , et al. October 20, 1	1998-10-20
Use of cobalt tungsten phosphide as a barrier material for copper metallization Grant 5,695,810 - Dubin , et al. December 9, 1	1997-12-09
Selective electroless copper deposited interconnect plugs for ULSI applications Grant 5,674,787 - Zhao , et al. October 7, 1	1997-10-07

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