| Patent | Date |
|---|
Novel Lga Architecture For Improving Reliability Performance Of Metal Defined Pads
App 20220199503 - DUBEY; Manish ; et al. | 2022-06-23 |
Microelectronic Component Having Molded Regions With Through-mold Vias
App 20220181262 - Ganesan; Sanka ; et al. | 2022-06-09 |
Microelectronic component having molded regions with through-mold vias
Grant 11,302,643 - Ganesan , et al. April 12, 2 | 2022-04-12 |
Microelectronic Structures Including Bridges
App 20210391273 - Dubey; Manish ; et al. | 2021-12-16 |
Microelectronic Structures Including Bridges
App 20210391295 - Karhade; Omkar G. ; et al. | 2021-12-16 |
Microelectronic Component Having Molded Regions With Through-mold Vias
App 20210305162 - Ganesan; Sanka ; et al. | 2021-09-30 |
Open Cavity Bridge Co-planar Placement Architectures And Processes
App 20210305132 - KARHADE; Omkar ; et al. | 2021-09-30 |
Integrated Heat Spreader (ihs) With Solder Thermal Interface Material (stim) Bleed-out Restricting Feature
App 20210020537 - Chan Arguedas; Sergio Antonio ; et al. | 2021-01-21 |
Integrated Heat Spreader (ihs) With Heating Element
App 20210013117 - Li; Peng ; et al. | 2021-01-14 |
Integrated Circuit Packages With Solder Thermal Interface Material
App 20200411407 - Dubey; Manish ; et al. | 2020-12-31 |
Channeled Lids For Integrated Circuit Packages
App 20200395269 - Dubey; Manish ; et al. | 2020-12-17 |
Thermal Management Solutions For Integrated Circuit Packages
App 20200227332 - Singh; Kumar Abhishek ; et al. | 2020-07-16 |
Foam composite
Grant 10,651,108 - Tang , et al. | 2020-05-12 |
Electronic package that includes multi-layer stiffener
Grant 10,535,615 - Dubey , et al. Ja | 2020-01-14 |
Microelectronic Device Interconnect Structure
App 20200006273 - Dubey; Manish ; et al. | 2020-01-02 |
Gradient encapsulant protection of devices in stretchable electronics
Grant 10,206,277 - Dias , et al. Feb | 2019-02-12 |
System For Development And Emulation Of Embedded Systems
App 20180357150 - Chaubey; Ashok Kumar ; et al. | 2018-12-13 |
Wavelength Modulatable Interferometer
App 20180283845 - Pacheco; Mario ; et al. | 2018-10-04 |
Electronic package and method of connecting a first die to a second die to form an electronic package
Grant 9,887,104 - Dubey , et al. February 6, 2 | 2018-02-06 |
Electronic Package That Includes Multi-layer Stiffener
App 20180033741 - Dubey; Manish ; et al. | 2018-02-01 |
Electronic package with corner supports
Grant 9,721,906 - Dubey , et al. August 1, 2 | 2017-08-01 |
Gradient Encapsulant Protection Of Devices In Stretchable Electronics
App 20170181275 - Dias; Rajendra C. ; et al. | 2017-06-22 |
Request change tracker
Grant 9,632,919 - Dubey , et al. April 25, 2 | 2017-04-25 |
Electronic Package With Corner Supports
App 20170062356 - Dubey; Manish ; et al. | 2017-03-02 |
Method And Process For Emib Chip Interconnections
App 20170018525 - Dias; Rajendra C. ; et al. | 2017-01-19 |
Microelectronic die having chamfered corners
Grant 9,508,660 - Dubey , et al. November 29, 2 | 2016-11-29 |
Reduction Of Underfill Filler Settling In Integrated Circuit Packages
App 20160343591 - Ramalingam; Suriyakala ; et al. | 2016-11-24 |
Method for reducing underfill filler settling in integrated circuit packages
Grant 9,431,274 - Ramalingam , et al. August 30, 2 | 2016-08-30 |
Microelectronic Die Having Chamfered Corners
App 20160233175 - Dubey; Manish ; et al. | 2016-08-11 |
Electronic Package And Method Of Connecting A First Die To A Second Die To Form An Electronic Package
App 20160005672 - Dubey; Manish ; et al. | 2016-01-07 |
Methods to prevent filler entrapment in microelectronic device to microelectronic substrate interconnection structures
Grant 9,230,833 - Dubey , et al. January 5, 2 | 2016-01-05 |
Product deployment system
Grant 9,092,287 - Dubey , et al. July 28, 2 | 2015-07-28 |
Methods To Prevent Filler Entrapment In Microelectronic Device To Microelectronic Substrate Interconnection Structures
App 20150179479 - Dubey; Manish ; et al. | 2015-06-25 |
Project Management Tool
App 20150143327 - Holmes; Scott ; et al. | 2015-05-21 |
Methods to prevent filler entrapment in microelectronic device to microelectronic substrate interconnection structures
Grant 8,999,765 - Dubey , et al. April 7, 2 | 2015-04-07 |
Product Deployment System
App 20150095903 - Dubey; Manish ; et al. | 2015-04-02 |
Request Change Tracker
App 20150095619 - Dubey; Manish ; et al. | 2015-04-02 |
Methods To Prevent Filler Entrapment In Microelectronic Device To Microelectronic Substrate Interconnection Structures
App 20140377916 - Dubey; Manish ; et al. | 2014-12-25 |
Product deployment system
Grant 8,918,781 - Dubey , et al. December 23, 2 | 2014-12-23 |
Reduction Of Underfill Filler Settling In Integrated Circuit Packages
App 20140177149 - Ramalingam; Suriyakala ; et al. | 2014-06-26 |
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