Du; Cuiming

Patent Applications and Registrations

Patent applications and USPTO patent grants for Du; Cuiming.The latest application filed is for "thermosetting resin composition, prepreg, laminate, and printed circuit board".

Company Profile

3.6.7

Du; Cuiming - Guangdong CN
DU; Cuiming - Dongguan CN
Du; Cuiming - Dongguan City CN

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Thermosetting resin composition, prepreg, laminate, and printed circuit board Grant 11,261,305 - Chen , et al. March 1, 2	2022-03-01
Vinyl thermosetting resin composition, prepreg, laminate, and printed circuit board Grant 11,053,352 - Chen , et al. July 6, 2	2021-07-06
Vinyl Thermosetting Resin Composition, Prepreg, Laminate, And Printed Circuit Board App 20200247947 - Kind Code	2020-08-06
Thermosetting Resin Composition, Prepreg, Laminate, And Printed Circuit Board App 20200247970 - Kind Code	2020-08-06
Thermosetting resin composition and uses thereof Grant 10,208,188 - Du , et al. Feb	2019-02-19
Thermosetting Resin Composition, Prepreg Containing Same, Laminated Board, And Printed Circuit Board App 20180346675 - Chen; Wenxin ; et al.	2018-12-06
Thermosetting resin composition and uses thereof Grant 10,053,547 - Du , et al. August 21, 2	2018-08-21
Epoxy resin composition and copper clad laminate manufactured by using same Grant 9,475,970 - Du , et al. October 25, 2	2016-10-25
Thermosetting Resin Composition And Uses Thereof App 20160264745 - Du; Cuiming ; et al.	2016-09-15
Thermosetting Resin Composition And Uses Thereof App 20160229990 - DU; Cuiming ; et al.	2016-08-11
Epoxy Resin Composition And Copper Clad Laminate Manufactured By Using Same App 20130295388 - Du; Cuiming ; et al.	2013-11-07

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