Du; Chen-Chung
Patent Applications and Registrations
Patent applications and USPTO patent grants for Du; Chen-Chung.The latest application filed is for "magnetic position sensing device and method".
- Du; Chen-Chung - Hsinchu TW
- Du; Chen-Chung - Hsinchu City TW
- Du; Chen-Chung - Hsinchu Hsien TW
| Patent | Date |
|---|---|
| Magnetic position detecting device and method Grant 10,948,315 - Wang , et al. March 16, 2 | 2021-03-16 |
| Magnetic Position Sensing Device And Method App 20200200568 - Wang; Yu-Ming ; et al. | 2020-06-25 |
| Plasma device and operation method of plasma device Grant 9,363,881 - Weng , et al. June 7, 2 | 2016-06-07 |
| Modular electrode device Grant 9,313,873 - Yang , et al. April 12, 2 | 2016-04-12 |
| Plasma Device And Operation Method Of Plasma Device App 20150156857 - Weng; Chih-Chiang ; et al. | 2015-06-04 |
| Substrate And Mask Attachment Clamp Device App 20140144377 - Du; Chen-Chung ; et al. | 2014-05-29 |
| Method for depositing microcrystalline silicon and monitor device of plasma enhanced deposition Grant 8,435,803 - Du , et al. May 7, 2 | 2013-05-07 |
| Transmission Mechanism And The Deposition Apparatus Using The Same App 20120240855 - Du; Chen-Chung ; et al. | 2012-09-27 |
| View Port Device For Plasma Process And Process Observation Device Of Plasma Apparatus App 20120111269 - DU; Chen-Chung ; et al. | 2012-05-10 |
| Method For Depositing Microcrystalline Silicon And Monitor Device Of Plasma Enhanced Deposition App 20110136269 - Du; Chen-Chung ; et al. | 2011-06-09 |
| Hollow cathode discharging apparatus Grant 7,721,673 - Du , et al. May 25, 2 | 2010-05-25 |
| Transmission Device For Thin And Brittleness Substrate App 20100116623 - Du; Chen-Chung ; et al. | 2010-05-13 |
| Susceptor Positioning And Supporting Device Of Vacuum Apparatus App 20090283042 - DU; Chen-Chung ; et al. | 2009-11-19 |
| System And Method For Plasma Enhanced Thin Film Deposition App 20090090616 - DU; CHEN-CHUNG ; et al. | 2009-04-09 |
| Wafer electroplating apparatus Grant 7,449,091 - Du , et al. November 11, 2 | 2008-11-11 |
| Hollow cathode discharging apparatus App 20080106202 - Du; Chen-Chung ; et al. | 2008-05-08 |
| Wafer electroplating apparatus App 20060137974 - Du; Chen-Chung ; et al. | 2006-06-29 |
| Compress and position apparatus Grant 7,021,208 - Du , et al. April 4, 2 | 2006-04-04 |
| Compress and position apparatus App 20050051023 - Du, Chen-Chung ; et al. | 2005-03-10 |
| Wafer electroplating apparatus and method App 20040124090 - Du, Chen-Chung ; et al. | 2004-07-01 |
| Solder-ball supplying apparatus Grant 5,878,911 - Lin , et al. March 9, 1 | 1999-03-09 |
| Coolant through spindle device Grant 5,327,979 - Du , et al. July 12, 1 | 1994-07-12 |
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