DRYER; Paul William

Patent Applications and Registrations

Patent applications and USPTO patent grants for DRYER; Paul William.The latest application filed is for "microfluidic cartridge comprising silicone pressure-sensitive adhesive".

Company Profile

1.16.13

DRYER; Paul William - Lexington KY
Dryer; Paul William - Gilbert AZ

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Microfluidic Cartridge Comprising Silicone Pressure-sensitive Adhesive App 20210016279 - NWACHUKWU; Chisomaga Ugochi ; et al.	2021-01-21
Formulation for silicon-doped ink used to prevent chip etching Grant 8,956,450 - Dryer , et al. February 17, 2	2015-02-17
Modular micro-fluid ejection head assembly Grant 8,882,221 - Bernard , et al. November 11, 2	2014-11-11
Method for making a substantially planar micro-fluid ejection head Grant 8,826,502 - Bernard , et al. September 9, 2	2014-09-09
Formulation For Silicon-doped Ink Used To Prevent Chip Etching App 20140026783 - DRYER; Paul William ; et al.	2014-01-30
Micro-fluid ejection heads and methods for bonding substrates to supports Grant 8,324,076 - Bernard , et al. December 4, 2	2012-12-04
Heater chips with silicon die bonded on silicon substrate Grant 8,087,756 - Anderson , et al. January 3, 2	2012-01-03
Methods for planarizing unevenness on surface of wafer photoresist layer and wafers produced by the methods Grant 8,071,275 - Bernard , et al. December 6, 2	2011-12-06
Heater Chips With Silicon Die Bonded On Silicon Substrate App 20110205305 - Anderson; Frank Edward ; et al.	2011-08-25
Heater chips with silicon die bonded on silicon substrate and methods of fabricating the heater chips Grant 7,938,513 - Anderson , et al. May 10, 2	2011-05-10
Micro-fluid ejection heads and methods for bonding substrates to supports Grant 7,815,289 - Bernard , et al. October 19, 2	2010-10-19
Micro-fluid Ejection Heads And Methods For Bonding Substrates To Supports App 20100230047 - Bernard; David Laurier ; et al.	2010-09-16
Micro-fluid Ejection Heads And Methods For Bonding Substrates To Supports App 20100229391 - Bernard; David Laurier ; et al.	2010-09-16
Modular Micro-fluid Ejection Head Assembly App 20100045736 - Bernard; David Laurier ; et al.	2010-02-25
Methods For Planarizing Unevenness On Surface Of Wafer Photoresist Layer And Wafers Produced By The Methods App 20090258322 - Bernard; David Laurier ; et al.	2009-10-15
Heater Chips With Silicon Die Bonded On Silicon Substrate And Methods Of Fabricating The Heater Chips App 20090256891 - Anderson; Frank Edward ; et al.	2009-10-15
Method of removing residue from a substrate after a DRIE process Grant 7,531,047 - Dryer , et al. May 12, 2	2009-05-12
Micro-fluid Ejection Heads And Methods For Bonding Substrates To Supports App 20090058945 - Bernard; David Laurier ; et al.	2009-03-05
Ink Tank Having Integrated Rfid Tag App 20080186187 - Adkins; Christopher Alan ; et al.	2008-08-07
Ink Tank Having Integrated Rfid Tag App 20080186367 - Adkins; Christopher Alan ; et al.	2008-08-07
Method and Apparatus for Maximizing Cooling for Wafer Processing App 20080083700 - Bernard; David Laurier ; et al.	2008-04-10
Method and apparatus for immersion treatment of semiconductor and other devices Grant 6,641,675 - Dryer , et al. November 4, 2	2003-11-04
Method for etching a dielectric layer over a semiconductor substrate Grant 6,187,216 - Dryer , et al. February 13, 2	2001-02-13
Method and apparatus for immersion cleaning of semiconductor devices Grant 6,021,791 - Dryer , et al. February 8, 2	2000-02-08
Carboxylic acid etching solution and method Grant 5,824,601 - Dao , et al. October 20, 1	1998-10-20

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