Drewery; John Stephen
Patent Applications and Registrations
Patent applications and USPTO patent grants for Drewery; John Stephen.The latest application filed is for "cooling for a plasma-based reactor".
- Drewery; John Stephen - San Jose CA
- Drewery; John Stephen - Santa Clara CA
- Drewery; John Stephen - Alameda CA
- Drewery; John Stephen - Mesa AZ
| Patent | Date |
|---|---|
| Cooling For A Plasma-based Reactor App 20220139671 - Drewery; John Stephen ; et al. | 2022-05-05 |
| Vacuum Pump Protection Against Deposition Byproduct Buildup App 20210257195 - DREWERY; John Stephen ; et al. | 2021-08-19 |
| Vacuum pump protection against deposition byproduct buildup Grant 11,031,215 - Drewery , et al. June 8, 2 | 2021-06-08 |
| Vacuum Pump Protection Against Deposition Byproduct Buildup App 20200105509 - Drewery; John Stephen ; et al. | 2020-04-02 |
| Photoresist-free Metal Deposition App 20140014522 - Mayer; Steven T. ; et al. | 2014-01-16 |
| Photoresist-free metal deposition Grant 8,500,985 - Mayer , et al. August 6, 2 | 2013-08-06 |
| Photoresist-free metal deposition Grant 7,947,163 - Mayer , et al. May 24, 2 | 2011-05-24 |
| Pad-assisted electropolishing Grant 7,686,935 - Mayer , et al. March 30, 2 | 2010-03-30 |
| Photoresist-free metal deposition App 20090277801 - Mayer; Steven T. ; et al. | 2009-11-12 |
| Pad-assisted electropolishing App 20090277802 - Mayer; Steven T. ; et al. | 2009-11-12 |
| Photoresist-free metal deposition App 20090280243 - Mayer; Steven T. ; et al. | 2009-11-12 |
| Pad-assisted electropolishing App 20090266707 - Mayer; Steven T. ; et al. | 2009-10-29 |
| Selectively accelerated plating of metal features Grant 7,560,016 - Mayer , et al. July 14, 2 | 2009-07-14 |
| Selectively accelerated plating of metal features Grant 7,449,099 - Mayer , et al. November 11, 2 | 2008-11-11 |
| Selectively accelerated plating of metal features Grant 7,405,163 - Drewery , et al. July 29, 2 | 2008-07-29 |
| Surface treatment using iodine plasma to improve metal deposition Grant 7,041,596 - Dalton , et al. May 9, 2 | 2006-05-09 |
| Method of fabricating an integrated circuit package utilizing an interposer surrounded by a flexible dielectric material with conductive posts Grant 6,743,661 - Drewery June 1, 2 | 2004-06-01 |
| Method and apparatus for ionized physical vapor deposition Grant 6,719,886 - Drewery , et al. April 13, 2 | 2004-04-13 |
| Methods for electroplating large copper interconnects Grant 6,699,396 - Drewery March 2, 2 | 2004-03-02 |
| Method and apparatus for ionized physical vapor deposition App 20020104751 - Drewery, John Stephen ; et al. | 2002-08-08 |
| Method and apparatus for ionized physical vapor deposition Grant 6,287,435 - Drewery , et al. September 11, 2 | 2001-09-11 |
| SEC | 0001380513 | DREWERY JOHN STEPHEN |
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