| Patent | Date |
|---|
Method for separating thin layers of solid material from a solid body
Grant 11,201,081 - Drescher , et al. December 14, 2 | 2021-12-14 |
Method for Producing a Layer of Solid Material
App 20210225694 - Drescher; Wolfram ; et al. | 2021-07-22 |
Solid Body and Multi-Component Arrangement
App 20210225659 - Drescher; Wolfram ; et al. | 2021-07-22 |
Wafer production method
Grant 11,004,723 - Drescher , et al. May 11, 2 | 2021-05-11 |
Method for thinning solid body layers provided with components
Grant 10,978,311 - Drescher , et al. April 13, 2 | 2021-04-13 |
Method of Treating a Solid Layer Bonded to a Carrier Substrate
App 20210039279 - Schilling; Franz ; et al. | 2021-02-11 |
Method for the material-saving production of wafers and processing of wafers
Grant 10,843,380 - Schilling , et al. November 24, 2 | 2020-11-24 |
Method of producing stresses in a semiconductor wafer
Grant 10,825,732 - Lichtensteiger , et al. November 3, 2 | 2020-11-03 |
Wafer Production Method
App 20200185267 - Drescher; Wolfram ; et al. | 2020-06-11 |
Method of Producing Stresses in a Semiconductor Wafer
App 20200144121 - Lichtensteiger; Lukas ; et al. | 2020-05-07 |
Combined wafer production method with laser treatment and temperature-induced stresses
Grant 10,593,590 - Drescher , et al. | 2020-03-17 |
Method and device for the production of wafers with a pre-defined break initiation point
Grant 10,580,699 - Lichtensteiger , et al. | 2020-03-03 |
Method for Thinning Solid Body Layers Provided with Components
App 20200066542 - Drescher; Wolfram ; et al. | 2020-02-27 |
Method for Separating Thin Layers of Solid Material from a Solid Body
App 20200006119 - Drescher; Wolfram ; et al. | 2020-01-02 |
Combined wafer production method with laser treatment and temperature-induced stresses
App 20190237359 - Drescher; Wolfram ; et al. | 2019-08-01 |
Combined wafer production method with laser treatment and temperature-induced stresses
Grant 10,312,135 - Drescher , et al. | 2019-06-04 |
Method and device for the production of wafers with a pre-defined break initiation point
Grant 10,304,738 - Lichtensteiger , et al. | 2019-05-28 |
Method and device for the production of wafers with a pre-defined break initiation point
Grant 10,269,643 - Lichtensteiger , et al. | 2019-04-23 |
Combined Production Mehtod For Separating A Number Of Thin Layers Of Solid Material From A Thick Solid Body
App 20190096746 - Drescher; Wolfram ; et al. | 2019-03-28 |
Splitting method and use of a material in a splitting method
Grant 10,229,835 - Drescher , et al. | 2019-03-12 |
Method And Device For The Production Of Wafers With A Pre-defined Break Initiation Point
App 20190019729 - Lichtensteiger; Lukas ; et al. | 2019-01-17 |
Combined production method for separating a number of thin layers of solid material from a thick solid body
Grant 10,141,219 - Drescher , et al. Nov | 2018-11-27 |
Method For The Material-saving Production Of Wafers And Processing Of Wafers
App 20180243944 - Schilling; Franz ; et al. | 2018-08-30 |
Splitting Method And Use Of A Material In A Splitting Method
App 20180233373 - DRESCHER; Wolfram ; et al. | 2018-08-16 |
Method of producing large-scale layers of solid material
Grant 10,029,277 - Lichtensteiger , et al. July 24, 2 | 2018-07-24 |
Method For The Low-loss Production Of Multi-component Wafers
App 20180118562 - Drescher; Wolfram ; et al. | 2018-05-03 |
Transparent And Highly Stable Screen Protector
App 20170362697 - Richter; Jan ; et al. | 2017-12-21 |
Method of producing large-scale layers of solid material
App 20170029974 - LICHTENSTEIGER; Lukas ; et al. | 2017-02-02 |
Combined wafer production method with laser treatment and temperature-induced stresses
App 20160254232 - Drescher; Wolfram ; et al. | 2016-09-01 |
Combined production method for separating a number of thin layers of solid material from a thick solid body
App 20160247713 - Drescher; Wolfram ; et al. | 2016-08-25 |
Method And Device For The Production Of Wafers With A Pre-Defined Break Initiation Point
App 20160064283 - Lichtensteiger; Lukas ; et al. | 2016-03-03 |
Method and system for calibrating a transmitting system
Grant 8,665,935 - Drescher March 4, 2 | 2014-03-04 |
Method and system for transmitting data from a medium access control device via a physical layer to an antenna
Grant 8,391,269 - Drescher March 5, 2 | 2013-03-05 |
Method and arrangement for bringing together data on parallel data paths
Grant 7,779,229 - Drescher August 17, 2 | 2010-08-17 |
Method for effecting the controlled shutdown of data processing units
Grant 7,685,439 - Drescher March 23, 2 | 2010-03-23 |
Processor bus arrangement
Grant 7,647,445 - Drescher , et al. January 12, 2 | 2010-01-12 |
Communication System And Method For Operating A Communication System
App 20090268794 - Drescher; Wolfram | 2009-10-29 |
Microprocessor program addressing arrangement having multiple independent complete address generators
Grant 7,577,818 - Drescher , et al. August 18, 2 | 2009-08-18 |
Method And A System For Controlling A Sleep Mode Of A Device In A Wireless Communications Network Or In A Mobile Point-to-point Connection
App 20090164821 - Drescher; Wolfram | 2009-06-25 |
Method and System For Calibrating a Transmitting System
App 20080298446 - Drescher; Wolfram | 2008-12-04 |
Method and System for Transmitting Data From a Medium Access Control Device Via a Physical Layer to an Antenna
App 20080279174 - Drescher; Wolfram | 2008-11-13 |
Method and System for Transmitting Data from a Medium Access Control Device Via a Physical Layer to an Antenna
App 20080267315 - Drescher; Wolfram | 2008-10-30 |
Method and arrangement for the power-efficient control of processors
App 20080215851 - Porst; Uwe ; et al. | 2008-09-04 |
Method and arrangement for power-efficient control of processors
App 20070150701 - Porst; Uwe ; et al. | 2007-06-28 |
Memory configuration with I/O support
Grant 7,143,211 - Drescher , et al. November 28, 2 | 2006-11-28 |
Method for effecting the controlled shutdown of data processing units
App 20060156062 - Drescher; Wolfram | 2006-07-13 |
Method and arrangement for bringing together data on parallel data paths
App 20060090060 - Drescher; Wolfram | 2006-04-27 |
Process and apparatus for finite field multiplication (FFM)
Grant 7,003,538 - Drescher February 21, 2 | 2006-02-21 |
Processor bus arrangement
App 20050216640 - Drescher, Wolfram ; et al. | 2005-09-29 |
Method and arrangement in a stack having a memory segmented into data groups having a plurality of elements
Grant 6,871,256 - Drescher , et al. March 22, 2 | 2005-03-22 |
Memory configuration with i/o support
App 20040054856 - Drescher, Wolfram ; et al. | 2004-03-18 |
Data path arrangement
App 20040044818 - Drescher, Wolfram ; et al. | 2004-03-04 |
Device and method for control of the data stream
App 20030005264 - Drescher, Wolfram ; et al. | 2003-01-02 |
Method and arrangement in a stack having a memory segmented into data groups having a plurality of elements
App 20020166021 - Drescher, Wolfram ; et al. | 2002-11-07 |
Process and apparatus for finite field multiplication (FFM)
App 20020138534 - Drescher, Wolfram | 2002-09-26 |
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