Dozier, II; Thomas H.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Dozier, II; Thomas H..The latest application filed is for "apparatus and method of testing singulated dies".

Company Profile

0.16.1

Dozier, II; Thomas H. - Livermore CA
Dozier, II; Thomas H. - Carrolton TX
Dozier, II; Thomas H. - Carrollton TX

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Apparatus and method of testing singulated dies Grant 8,513,969 - Dozier, II , et al. August 20, 2	2013-08-20
Apparatus And Method Of Testing Singulated Dies App 20100244873 - Dozier, II; Thomas H. ; et al.	2010-09-30
Apparatus and method of testing singulated dies Grant 7,733,106 - Dozier, II , et al. June 8, 2	2010-06-08
Contact carriers (tiles) for populating larger substrates with spring contacts Grant 7,714,598 - Eldridge , et al. May 11, 2	2010-05-11
Contact carriers (tiles) for populating larger substrates with spring contacts Grant 7,347,702 - Eldridge , et al. March 25, 2	2008-03-25
Contact carriers (tiles) for populating larger substrates with spring contacts Grant 7,140,883 - Khandros , et al. November 28, 2	2006-11-28
Sockets for "springed" semiconductor devices Grant 7,059,047 - Dozier, II , et al. June 13, 2	2006-06-13
Methods of removably mounting electronic components to a circuit board, and sockets formed by the methods Grant 6,913,468 - Dozier, II , et al. July 5, 2	2005-07-05
Interposer, socket and assembly for socketing an electronic component and method of making and using same Grant 6,669,489 - Dozier, II , et al. December 30, 2	2003-12-30
Sockets for "springed" semiconductor devices Grant 6,642,625 - Dozier, II , et al. November 4, 2	2003-11-04
Sockets for "springed" semiconductor devices Grant 6,534,856 - Dozier, II , et al. March 18, 2	2003-03-18
Sockets for "springed" semiconductor devices Grant 6,232,149 - Dozier, II , et al. May 15, 2	2001-05-15
Sockets for "springed" semiconductor devices Grant 6,033,935 - Dozier, II , et al. March 7, 2	2000-03-07
Solder preforms Grant 5,820,014 - Dozier, II , et al. October 13, 1	1998-10-13
Sockets for electronic components and methods of connecting to electronic components Grant 5,772,451 - Dozier, II , et al. June 30, 1	1998-06-30
Land grid array package/circuit board assemblies and methods for constructing the same Grant 5,473,510 - Dozier, II December 5, 1	1995-12-05

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