Downey; Susan H.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Downey; Susan H..The latest application filed is for "method and apparatus for providing structural support for interconnect pad while allowing signal conductance".

Company Profile

0.11.8

Downey; Susan H. - Austin TX

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method and apparatus for providing structural support for interconnect pad while allowing signal conductance Grant 7,626,276 - Hess , et al. December 1, 2	2009-12-01
Method And Apparatus For Providing Structural Support For Interconnect Pad While Allowing Signal Conductance App 20070210442 - Hess; Kevin J. ; et al.	2007-09-13
Method and apparatus for providing structural support for interconnect pad while allowing signal conductance Grant 7,241,636 - Hess , et al. July 10, 2	2007-07-10
Packaged IC using insulated wire Grant 7,138,328 - Downey , et al. November 21, 2	2006-11-21
Method and apparatus for providing structural support for interconnect pad while allowing signal conductance App 20060154469 - Hess; Kevin J. ; et al.	2006-07-13
Packaged integrated circuit having wire bonds and method therefor Grant 7,015,585 - Downey , et al. March 21, 2	2006-03-21
Inductive device including bond wires Grant 6,998,952 - Zhou , et al. February 14, 2	2006-02-14
Semiconductor device having a bond pad and method therefor Grant 6,921,979 - Downey , et al. July 26, 2	2005-07-26
Semiconductor device having a wire bond pad and method therefor Grant 6,846,717 - Downey , et al. January 25, 2	2005-01-25
Packaged IC using insulated wire App 20040217458 - Downey, Susan H. ; et al.	2004-11-04
Packaged integrated circuit having wire bonds and method therefor App 20040119168 - Downey, Susan H. ; et al.	2004-06-24
Packaged IC using insulated wire App 20040119172 - Downey, Susan H. ; et al.	2004-06-24
Integrated circuit die I/O cells Grant 6,717,270 - Downey , et al. April 6, 2	2004-04-06
Semiconductor device having a wire bond pad and method therefor App 20040036174 - Downey, Susan H. ; et al.	2004-02-26
Semiconductor Device Having A Wire Bond Pad And Method Therefor App 20030173637 - Downey, Susan H. ; et al.	2003-09-18
Semiconductor device having a bond pad and method therefor App 20030173668 - Downey, Susan H. ; et al.	2003-09-18
Semiconductor device having a wire bond pad and method therefor Grant 6,614,091 - Downey , et al. September 2, 2	2003-09-02
Flux composition and corresponding soldering method Grant 5,615,827 - Arldt , et al. April 1, 1	1997-04-01
Flux composition and corresponding soldering method Grant 5,531,838 - Arldt , et al. July 2, 1	1996-07-02

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