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Patent applications and USPTO patent grants for Downes; Keith E..The latest application filed is for "dual-damascene process to fabricate thick wire structure".
Patent | Date |
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Dual-damascene process to fabricate thick wire structure Grant 9,171,778 - Coolbaugh , et al. October 27, 2 | 2015-10-27 |
Dual-damascene process to fabricate thick wire structure Grant 8,753,950 - Coolbaugh , et al. June 17, 2 | 2014-06-17 |
Dual-damascene Process To Fabricate Thick Wire Structure App 20140151899 - COOLBAUGH; Douglas D. ;   et al. | 2014-06-05 |
Process for single and multiple level metal-insulator-metal integration with a single mask Grant 8,435,864 - Chinthakindi , et al. May 7, 2 | 2013-05-07 |
Dual-damascene process to fabricate thick wire structure Grant 8,236,663 - Coolbaugh , et al. August 7, 2 | 2012-08-07 |
Dual-damascene Process To Fabricate Thick Wire Structure App 20120190164 - COOLBAUGH; Douglas D. ;   et al. | 2012-07-26 |
Method and structure for creation of a metal insulator metal capacitor Grant 8,227,849 - Eshun , et al. July 24, 2 | 2012-07-24 |
Process For Single And Multiple Level Metal-insulator-metal Integration With A Single Mask App 20120184081 - CHINTHAKINDI; Anil K. ;   et al. | 2012-07-19 |
Process for single and multiple level metal-insulator-metal integration with a single mask Grant 8,207,568 - Chinthakindi , et al. June 26, 2 | 2012-06-26 |
Method Of Fabricating A Precision Buried Resistor App 20110108919 - Chinthakindi; Anil K. ;   et al. | 2011-05-12 |
Method of fabricating a precision buried resistor Grant 7,910,450 - Chinthakindi , et al. March 22, 2 | 2011-03-22 |
Metal seed layer deposition Grant 7,879,716 - Barkyoumb , et al. February 1, 2 | 2011-02-01 |
Method And Structure For Creation Of A Metal Insulator Metal Capacitor App 20100149723 - ESHUN; EBENEZER E. ;   et al. | 2010-06-17 |
Method and structure for creation of a metal insulator metal capacitor Grant 7,728,372 - Eshun , et al. June 1, 2 | 2010-06-01 |
Dual-damascene Process To Fabricate Thick Wire Structure App 20100009509 - Coolbaugh; Douglas D. ;   et al. | 2010-01-14 |
Dual-damascene process to fabricate thick wire structure Grant 7,602,068 - Coolbaugh , et al. October 13, 2 | 2009-10-13 |
Method And Structure For Creation Of A Metal Insulator Metal Capacitor App 20070262416 - Eshun; Ebenezer E. ;   et al. | 2007-11-15 |
Method Of Fabricating A Precision Buried Resistor App 20070194390 - Chinthakindi; Anil K. ;   et al. | 2007-08-23 |
Dual-damascene Process To Fabricate Thick Wire Structure App 20070190718 - Coolbaugh; Douglas D. ;   et al. | 2007-08-16 |
Metal Seed Layer Deposition App 20070155164 - Barkyoumb; Steven P. ;   et al. | 2007-07-05 |
Metal seed layer deposition Grant 7,235,487 - Barkyoumb , et al. June 26, 2 | 2007-06-26 |
Process For Single And Multiple Level Metal-insulator-metal Integration With A Single Mask App 20070065966 - Chinthakindi; Anil K. ;   et al. | 2007-03-22 |
Metal Seed Layer Deposition App 20050253265 - Barkyoumb, Steven P. ;   et al. | 2005-11-17 |
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