loadpatents
name:-0.011295080184937
name:-0.0091037750244141
name:-0.002004861831665
Downes; Gary C. Patent Filings

Downes; Gary C.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Downes; Gary C..The latest application filed is for "dry heat diffusion cell and diffusion sampling system".

Company Profile
1.6.7
  • Downes; Gary C. - Moorpark CA
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Dry heat diffusion cell and diffusion sampling system
Grant 10,753,841 - Shaw , et al. A
2020-08-25
Dry Heat Diffusion Cell and Diffusion Sampling System
App 20190353570 - Shaw; Steven W. ;   et al.
2019-11-21
Method of processing and plating planar articles
Grant 6,558,750 - Gramarossa , et al. May 6, 2
2003-05-06
Method of processing and plating planar articles
App 20030012885 - Gramarossa, Daniel J. ;   et al.
2003-01-16
Processing cells for wafers and other planar articles
App 20030010625 - Gramarossa, Daniel J. ;   et al.
2003-01-16
Method of processing and plating wafers and other planar articles
App 20030013285 - Gramarossa, Daniel J. ;   et al.
2003-01-16
System for plating planar articles
App 20030010626 - Gramarossa, Daniel J. ;   et al.
2003-01-16
Automatic wafer processing and plating system
App 20030010449 - Gramarossa, Daniel J. ;   et al.
2003-01-16
Method Of Processing Wafers And Other Planar Articles Within A Processing Cell
App 20030010643 - Gramarossa, Daniel J. ;   et al.
2003-01-16
Apparatus and method for plating wafers, substrates and other articles
Grant 6,299,751 - Kaufman , et al. October 9, 2
2001-10-09
Apparatus and method for plating wafers, substrates and other articles
Grant 6,274,024 - Kaufman , et al. August 14, 2
2001-08-14
Anode having separately excitable sections to compensate for non-uniform plating deposition across the surface of a wafer due to seed layer resistance
Grant 6,251,238 - Kaufman , et al. June 26, 2
2001-06-26
Apparatus and method for plating wafers, substrates and other articles
Grant 6,197,182 - Kaufman , et al. March 6, 2
2001-03-06

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