Dow; Wei-Ping

Patent Applications and Registrations

Patent applications and USPTO patent grants for Dow; Wei-Ping.The latest application filed is for "composite with hollow nano-structures and application thereof".

Company Profile

5.5.8

Dow; Wei-Ping - Taichung TW
Dow; Wei-Ping - Taichung City TW
Dow; Wei-ping - Yunlin JP
Dow; Wei-Ping - Douliou TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Composite with hollow nano-structures and application thereof Grant 11,252,816 - Wu , et al. February 15, 2	2022-02-15
Method for manufacturing copper foil with rough surface in plating tank and its product Grant 11,008,665 - Dow , et al. May 18, 2	2021-05-18
Composite with Hollow Nano-Structures and Application Thereof App 20200154565 - Wu; Tzong-Ming ; et al.	2020-05-14
Method for modifying surface of non-conductive substrate and sidewall of micro/nano hole with rGO Grant 10,543,510 - Dow , et al. Ja	2020-01-28
Method For Manufacturing Copper Foil With Rough Surface In Plating Tank And Its Product App 20190376198 - Dow; Wei-Ping ; et al.	2019-12-12
Method for producing flexible conductive substrate with high transmittance and product thereof Grant 10,465,056 - Dow , et al. No	2019-11-05
Manufacturing Method Of Ultra-large Copper Grains Without Heat Treatment App 20180355499 - Dow; Wei-Ping ; et al.	2018-12-13
Method For Producing Flexible Conductive Substrate With High Transmittance And Product Thereof App 20180340050 - Dow; Wei-Ping ; et al.	2018-11-29
METHOD FOR MODIFYING SURFACE OF NON-CONDUCTIVE SUBSTRATE AND SIDEWALL OF MICRO/NANO HOLE WITH rGO AND CONDITIONER EMPLOYED THEREIN App 20180036769 - Dow; Wei-Ping ; et al.	2018-02-08
Method of coating surface of substrate hole with layer of reduced graphene oxide Grant 9,105,696 - Dow , et al. August 11, 2	2015-08-11
Additive For Copper Plating And Process For Producing Electronic Circiut Substrate Therewith App 20080087549 - Ishizuka; Hiroshi ; et al.	2008-04-17
Method For Monitoring The Filling Performance Of Copper Plating Formula For Microvia Filling App 20070215479 - Dow; Wei-Ping ; et al.	2007-09-20
Method Of Analyzing Accelerator For Copper Electroplating App 20070215490 - Dow; Wei-Ping ; et al.	2007-09-20

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.