DOU; Juying
Patent Applications and Registrations
Patent applications and USPTO patent grants for DOU; Juying.The latest application filed is for "method, apparatus, and system for wafer grounding".
- DOU; Juying - San Jose CA
| Patent | Date |
|---|---|
| Method, Apparatus, And System For Wafer Grounding App 20220277926 - WANG; Yixiang ; et al. | 2022-09-01 |
| Electron Emitter And Method Of Fabricating Same App 20220189725 - DOU; Juying ; et al. | 2022-06-16 |
| Electron emitter and method of fabricating same Grant 11,201,032 - Dou , et al. December 14, 2 | 2021-12-14 |
| Apparatus Of Plural Charged-particle Beams App 20210384008 - LI; Shuai ; et al. | 2021-12-09 |
| Apparatus of plural charged-particle beams Grant 11,062,877 - Li , et al. July 13, 2 | 2021-07-13 |
| Electron Emitter And Method Of Fabricating Same App 20210142975 - Dou; Juying ; et al. | 2021-05-13 |
| Electron emitter and method of fabricating same Grant 10,784,071 - Dou , et al. Sept | 2020-09-22 |
| Apparatus Of Plural Charged-particle Beams App 20200152421 - Li; Shuai ; et al. | 2020-05-14 |
| Apparatus of plural charged-particle beams Grant 10,541,110 - Li , et al. Ja | 2020-01-21 |
| Electron Emitter And Method Of Fabricating Same App 20190172674 - DOU; Juying ; et al. | 2019-06-06 |
| Apparatus Of Plural Charged-particle Beams App 20180350555 - LI; Shuai ; et al. | 2018-12-06 |
| Wafer grounding and biasing method, apparatus, and application Grant 9,991,147 - Wang , et al. June 5, 2 | 2018-06-05 |
| Apparatus of plural charged-particle beams Grant 9,922,799 - Li , et al. March 20, 2 | 2018-03-20 |
| Apparatus of Plural Charged-Particle Beams App 20170025241 - Li; Shuai ; et al. | 2017-01-26 |
| Wafer Grounding And Biasing Method, Apparatus, Andapplication App 20150049411 - WANG; YI-XIANG ; et al. | 2015-02-19 |
| Wafer grounding and biasing method, apparatus, and application Grant 8,908,348 - Wang , et al. December 9, 2 | 2014-12-09 |
| Filament for electron source Grant 8,896,195 - Dou November 25, 2 | 2014-11-25 |
| Apparatus for increasing electric conductivity to a semiconductor wafer substrate when exposure to electron beam Grant 8,218,284 - Chen , et al. July 10, 2 | 2012-07-10 |
| Filament for Electron Source App 20120098409 - DOU; Juying | 2012-04-26 |
| Wafer grounding methodology Grant 8,094,428 - Wang , et al. January 10, 2 | 2012-01-10 |
| Thermal field emission cathode Grant 8,022,609 - Chen , et al. September 20, 2 | 2011-09-20 |
| Electron beam apparatus Grant 7,960,697 - Chen , et al. June 14, 2 | 2011-06-14 |
| Thermal Field Emission Cathode App 20110084591 - CHEN; Zhong-Wei ; et al. | 2011-04-14 |
| Wafer Grounding And Biasing Method, Apparatus, And Application App 20110051306 - WANG; YI-XIANG ; et al. | 2011-03-03 |
| Electron beam apparatus Grant 7,759,653 - Chen , et al. July 20, 2 | 2010-07-20 |
| Electron Beam Apparatus App 20100102227 - CHEN; ZHONGWEI ; et al. | 2010-04-29 |
| Wafer Grounding Methodology App 20100103583 - WANG; YI XIANG ; et al. | 2010-04-29 |
| Apparatus For Increasing Electric Conductivity To A Semiconductor Wafer Substrate When Exposure To Electron Beam App 20100019462 - CHEN; Zhong-Wei ; et al. | 2010-01-28 |
| Thermal Field Emission Cathode App 20090315444 - Chen; Zhong-Wei ; et al. | 2009-12-24 |
| Electron Beam Apparatus App 20090294664 - Chen; Zhong-Wei ; et al. | 2009-12-03 |
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