loadpatents
name:-0.02313494682312
name:-0.013630867004395
name:-0.0015509128570557
Dotta; Yoshihisa Patent Filings

Dotta; Yoshihisa

Patent Applications and Registrations

Patent applications and USPTO patent grants for Dotta; Yoshihisa.The latest application filed is for "solar cell module, wiring sheet, and method of manufacturing wiring sheet".

Company Profile
1.12.16
  • Dotta; Yoshihisa - Sakai JP
  • DOTTA; YOSHIHISA - Sakai City JP
  • Dotta; Yoshihisa - Osaka-shi JP
  • Dotta; Yoshihisa - Osaka JP
  • Dotta; Yoshihisa - Nara JP
  • Dotta; Yoshihisa - Nara-shi JP
  • Dotta; Yoshihisa - Tenri JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Solar cell module, wiring sheet, and method of manufacturing wiring sheet
Grant 11,195,965 - Dotta , et al. December 7, 2
2021-12-07
Solar Cell Module, Wiring Sheet, And Method Of Manufacturing Wiring Sheet
App 20190131466 - DOTTA; YOSHIHISA ;   et al.
2019-05-02
Solar Battery Module And Solar Power Generation System
App 20150287844 - Sainoh; Yasushi ;   et al.
2015-10-08
Solar Cell With Interconnection Sheet, Solar Cell Module, And Method For Producing Solar Cell With Internconnection Sheet
App 20120097245 - Nishina; Tomohiro ;   et al.
2012-04-26
Back Electrode Type Solar Cell, Solar Cell With Interconnection Sheet, And Solar Cell Module
App 20120085405 - Dotta; Yoshihisa ;   et al.
2012-04-12
Wiring Sheet, Solar Cell With Wiring Sheet, Solar Cell Module, And Method For Fabricating Solar Cell With Wiring Sheet
App 20120037203 - Sainoo; Yasushi ;   et al.
2012-02-16
Method of forming electrode for semiconductor device
Grant 7,442,642 - Dotta October 28, 2
2008-10-28
Semiconductor device and fabrication method thereof
Grant 7,365,440 - Dotta April 29, 2
2008-04-29
Semiconductor package and a method for producing the same
Grant 7,327,041 - Dotta , et al. February 5, 2
2008-02-05
Semiconductor device and chip-stack semiconductor device
Grant 7,276,780 - Dotta , et al. October 2, 2
2007-10-02
Semiconductor device and chip-stack semiconductor device
App 20060231928 - Dotta; Yoshihisa ;   et al.
2006-10-19
Semiconductor device and chip-stack semiconductor device
Grant 7,115,972 - Dotta , et al. October 3, 2
2006-10-03
Fabrication method of semiconductor device
Grant 7,052,934 - Kurimoto , et al. May 30, 2
2006-05-30
Semiconductor device and fabrication method thereof
App 20060071347 - Dotta; Yoshihisa
2006-04-06
Semiconductor device and fabrication method thereof
App 20060068580 - Dotta; Yoshihisa
2006-03-30
Semiconductor device and package product of the semiconductor device
Grant 6,847,121 - Dotta , et al. January 25, 2
2005-01-25
Semiconductor apparatus and production method thereof
App 20040212086 - Dotta, Yoshihisa ;   et al.
2004-10-28
Fabrication method of semiconductor device
App 20040188861 - Kurimoto, Hideyuki ;   et al.
2004-09-30
Chip-stack semiconductor device and manufacturing method of the same
App 20040080013 - Kimura, Toshio ;   et al.
2004-04-29
Semiconductor device and chip-stack semiconductor device
App 20040080045 - Kimura, Toshio ;   et al.
2004-04-29
Semiconductor device and chip-stack semiconductor device
App 20040080040 - Dotta, Yoshihisa ;   et al.
2004-04-29
Semiconductor device, packaging method thereof, and package product thereof
App 20030124769 - Dotta, Yoshihisa ;   et al.
2003-07-03
Semiconductor device and manufacturing method thereof
Grant 6,518,090 - Dotta , et al. February 11, 2
2003-02-11
Semiconductor package and a method for producing the same
App 20020197771 - Dotta, Yoshihisa ;   et al.
2002-12-26
Semiconductor device and manufacturing method thereof
App 20020076858 - Dotta, Yoshihisa ;   et al.
2002-06-20
Semiconductor device and manufacturing method thereof
Grant 6,353,263 - Dotta , et al. March 5, 2
2002-03-05
Semiconductor device using a chip scale package
Grant 6,157,080 - Tamaki , et al. December 5, 2
2000-12-05
Display device having an improvement in insulating between conductors connected to electronic components
Grant 5,016,986 - Kawashima , et al. May 21, 1
1991-05-21

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