| Patent | Date |
|---|
Process that includes assembling together first and second substrates the have respective first and second carbon nanotube arrays with geometrically complementary patterns
Grant 8,404,519 - Chrysler , et al. March 26, 2 | 2013-03-26 |
Carbon Nanotube And Metal Thermal Interface Material, Process Of Making Same, Packages Containing Same, And Systems Containing Same
App 20110214285 - Chrysler; Gregory M. ; et al. | 2011-09-08 |
Process of making carbon nanotube array that includes impregnating the carbon nanotube array with metal
Grant 7,964,447 - Chrysler , et al. June 21, 2 | 2011-06-21 |
Packaging of integrated circuits with carbon nanotube arrays to enhance heat dissipation through a thermal interface
Grant 7,847,394 - Dubin , et al. December 7, 2 | 2010-12-07 |
Conductive interconnects along the edge of a microelectronic device
Grant 7,750,441 - Hsu , et al. July 6, 2 | 2010-07-06 |
Packaging of integrated circuits with carbon nano-tube arrays to enhance heat dissipation through a thermal interface
Grant 7,704,791 - Dubin , et al. April 27, 2 | 2010-04-27 |
Methods for manufacturing imprinted substrates
Grant 7,637,008 - Dory , et al. December 29, 2 | 2009-12-29 |
Substrate-imprinting methods
Grant 7,594,321 - Dory , et al. September 29, 2 | 2009-09-29 |
Methods of forming a diamond micro-channel structure and resulting devices
Grant 7,550,841 - Dory June 23, 2 | 2009-06-23 |
Article having metal impregnated within carbon nanotube array
Grant 7,545,030 - Chrysler , et al. June 9, 2 | 2009-06-09 |
Deep via seed repair using electroless plating chemistry
Grant 7,479,687 - Dory , et al. January 20, 2 | 2009-01-20 |
Compliant multi-composition interconnects
Grant 7,400,041 - Muthukumar , et al. July 15, 2 | 2008-07-15 |
Array capacitor for decoupling multiple voltages
App 20080157313 - Dattaguru; Sriram ; et al. | 2008-07-03 |
Electronic packages and components thereof formed by substrate-imprinting
Grant 7,371,975 - Dory , et al. May 13, 2 | 2008-05-13 |
High Performance Integrated Inductor
App 20080023791 - Muthukumar; Sriram ; et al. | 2008-01-31 |
Packaging of integrated circuits with carbon nano-tube arrays to enhance heat dissipation through a thermal interface
Grant 7,316,061 - Dubin , et al. January 8, 2 | 2008-01-08 |
Conductive interconnects along the edge of a microelectronic device
App 20080001269 - Hsu; Rockwell M. ; et al. | 2008-01-03 |
Substrate-imprinting Apparatus And Methods
App 20080000674 - Dory; Thomas S. ; et al. | 2008-01-03 |
Packaging of integrated circuits with carbon nano-tube arrays to enhance heat dissipation through a thermal interface
App 20080003801 - Dubin; Valery M. ; et al. | 2008-01-03 |
High performance integrated inductor
Grant 7,294,525 - Muthukumar , et al. November 13, 2 | 2007-11-13 |
Methods of forming a diamond micro-channel structure and resulting devices
App 20070224727 - Dory; Thomas S. | 2007-09-27 |
Carbon nanotube and metal thermal interface material, process of making same, packages containing same, and systems containing same
App 20070155136 - Chrysler; Gregory M. ; et al. | 2007-07-05 |
Low cost microelectronic circuit package
Grant 7,183,658 - Towle , et al. February 27, 2 | 2007-02-27 |
High performance integrated inductor
App 20060270065 - Muthukumar; Sriram ; et al. | 2006-11-30 |
Packaging of integrated circuits with carbon nanotube arrays to enhance heat dissipation through a thermal interface
App 20060222852 - Dubin; Valery M. ; et al. | 2006-10-05 |
Deep via seed repair using electroless plating chemistry
App 20060068181 - Dory; Thomas S. ; et al. | 2006-03-30 |
Forming a combined copper diffusion barrier and seed layer
App 20060063379 - Dory; Thomas S. ; et al. | 2006-03-23 |
Self-aligned coaxial via capacitors
Grant 6,963,483 - Chakravorty , et al. November 8, 2 | 2005-11-08 |
Compliant multi-composition interconnects
App 20050239275 - Muthukumar, Sriram ; et al. | 2005-10-27 |
Deep via seed repair using electroless plating chemistry
App 20050067295 - Dory, Thomas S. ; et al. | 2005-03-31 |
Packaging of integrated circuits with carbon nano-tube arrays to enhance heat dissipation through a thermal interface
App 20040150100 - Dubin, Valery M. ; et al. | 2004-08-05 |
Substrate-imprinting apparatus, methods of manufacture, and products formed therefrom
App 20040118604 - Dory, Thomas S. ; et al. | 2004-06-24 |
Imprinted substrate and methods of manufacture
App 20040118594 - Dory, Thomas S. ; et al. | 2004-06-24 |
Self-aligned coaxial via capacitors
App 20030168342 - Chakravorty, Kishore K. ; et al. | 2003-09-11 |
Controlling underfill flow locations on high density packages using physical trenches and dams
Grant 6,614,122 - Dory , et al. September 2, 2 | 2003-09-02 |
Self-aligned coaxial via capacitors
Grant 6,565,730 - Chakravorty , et al. May 20, 2 | 2003-05-20 |
Low cost microelectronic circuit package
App 20030045083 - Towle, Steven ; et al. | 2003-03-06 |
Self-aligned Coaxial Via Capacitors
App 20020134685 - CHAKRAVORTY, KISHORE K. ; et al. | 2002-09-26 |
Process for plasma depositing silicon nitride and silicon dioxide films onto a substrate
Grant 4,877,641 - Dory October 31, 1 | 1989-10-31 |
Process for thermally depositing silicon nitride and silicon dioxide films onto a substrate
Grant 4,877,651 - Dory October 31, 1 | 1989-10-31 |
Use of selected beta-nitroalkenes as cetane number boosters for diesel fuel
Grant 4,561,862 - Dory December 31, 1 | 1985-12-31 |
| 