| Patent | Date |
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Metal liner passivation and adhesion enhancement by zinc doping
Grant 11,424,158 - Dordi , et al. August 23, 2 | 2022-08-23 |
Metal Liner Passivation And Adhesion Enhancement By Zinc Doping
App 20200365453 - Dordi; Yezdi N. ; et al. | 2020-11-19 |
Metal liner passivation and adhesion enhancement by zinc doping
Grant 10,741,440 - Dordi , et al. A | 2020-08-11 |
Metal Liner Passivation And Adhesion Enhancement By Zinc Doping
App 20190371659 - DORDI; Yezdi N. ; et al. | 2019-12-05 |
Method Of Etching An Etch Layer
App 20140256142 - DORDI; Yezdi N. | 2014-09-11 |
Method of etching an etch layer
Grant 8,822,344 - Dordi September 2, 2 | 2014-09-02 |
Methods And Apparatuses For Three Dimensional Integrated Circuits
App 20140145334 - BOYD; John ; et al. | 2014-05-29 |
Electroless copper deposition
Grant 8,524,329 - Dordi , et al. September 3, 2 | 2013-09-03 |
Electroless Copper Deposition
App 20130149461 - DORDI; Yezdi N. ; et al. | 2013-06-13 |
Proximity processing using controlled batch volume with an integrated proximity head
Grant 8,221,608 - Woods , et al. July 17, 2 | 2012-07-17 |
Methods of low-K dielectric and metal process integration
Grant 8,084,356 - Dordi , et al. December 27, 2 | 2011-12-27 |
Apparatus And Method For Depositing And Planarizing Thin Films Of Semiconductor Wafers
App 20110155563 - Ravkin; Mike ; et al. | 2011-06-30 |
Apparatus and method for depositing and planarizing thin films of semiconductor wafers
Grant 7,947,157 - Ravkin , et al. May 24, 2 | 2011-05-24 |
Proximity Processing Using Controlled Batch Volume With An Integrated Proximity Head
App 20110017605 - Woods; Carl A. ; et al. | 2011-01-27 |
Apparatus for plating semiconductor wafers
Grant 7,862,693 - Dordi , et al. January 4, 2 | 2011-01-04 |
Proximity processing using controlled batch volume with an integrated proximity head
Grant 7,811,423 - Woods , et al. October 12, 2 | 2010-10-12 |
Apparatus and method for plating semiconductor wafers
Grant 7,645,364 - Dordi , et al. January 12, 2 | 2010-01-12 |
Apparatus for Plating Semiconductor Wafers
App 20090321250 - Dordi; Yezdi N. ; et al. | 2009-12-31 |
Methods Of Low-k Dielectric And Metal Process Integration
App 20090087980 - DORDI; Yezdi N. ; et al. | 2009-04-02 |
Proximity Processing Using Controlled Batch Volume With An Integrated Proximtiy Head
App 20080296166 - Woods; Carl A. ; et al. | 2008-12-04 |
Apparatus and method for plating semiconductor wafers
App 20080271992 - Dordi; Yezdi N. ; et al. | 2008-11-06 |
Flow diffuser to be used in electro-chemical plating system
Grant 7,427,338 - Dordi , et al. September 23, 2 | 2008-09-23 |
Apparatus and method for depositing and planarizing thin films of semiconductor wafers
Grant 7,153,400 - Ravkin , et al. December 26, 2 | 2006-12-26 |
Apparatus and method for depositing and planarizing thin films of semiconductor wafers
App 20060260932 - Ravkin; Mike ; et al. | 2006-11-23 |
Method of stabilizing additive concentrations in an electroplating bath for interconnect formation
App 20060108228 - Kovarsky; Nicolay Y. ; et al. | 2006-05-25 |
Stabilization of additives concentration in electroplating baths for interconnect formation
App 20050016857 - Kovarsky, Nicolay Y. ; et al. | 2005-01-27 |
Deposition uniformity control for electroplating apparatus, and associated method
Grant 6,837,978 - Hey , et al. January 4, 2 | 2005-01-04 |
Apparatus and method for depositing and planarizing thin films of semiconductor wafers
App 20040178060 - Ravkin, Mike ; et al. | 2004-09-16 |
Electrochemical processing cell
App 20040134775 - Yang, Michael X. ; et al. | 2004-07-15 |
Flow diffuser to be used in electro-chemical plating system
App 20040035695 - Dordi, Yezdi N. ; et al. | 2004-02-26 |
Insoluble anode loop in copper electrodeposition cell for interconnect formation
App 20040026255 - Kovarsky, Nicolay Y. ; et al. | 2004-02-12 |
Immersion bias for use in electro-chemical plating system
App 20040020780 - Hey, H. Peter W. ; et al. | 2004-02-05 |
Tilted electrochemical plating cell with constant wafer immersion angle
App 20040016648 - Lubomirsky, Dmitry ; et al. | 2004-01-29 |
Method and associated apparatus for tilting a substrate upon entry for metal deposition
App 20030201184 - Dordi, Yezdi N. ; et al. | 2003-10-30 |
Electric contact element for electrochemical deposition system and method
Grant 6,613,214 - Dordi , et al. September 2, 2 | 2003-09-02 |
Method and associated apparatus for tilting a substrate upon entry for metal deposition
Grant 6,582,578 - Dordi , et al. June 24, 2 | 2003-06-24 |
Integrated solder bump deposition apparatus and method
Grant 6,572,010 - Dordi , et al. June 3, 2 | 2003-06-03 |
Reverse Voltage Bias For Electro-chemical Plating System And Method
App 20030034250 - Hey, H. Peter W. ; et al. | 2003-02-20 |
Perforated anode for uniform deposition of a metal layer
Grant 6,521,102 - Dordi February 18, 2 | 2003-02-18 |
Integrated solder bump deposition apparatus and method
App 20020185523 - Dordi, Yezdi N. ; et al. | 2002-12-12 |
Method and apparatus for patching electrochemically deposited layers using electroless deposited materials
App 20020043466 - Dordi, Yezdi N. ; et al. | 2002-04-18 |
Flow diffuser to be used in electro-chemical plating system
App 20010052465 - Dordi, Yezdi N. ; et al. | 2001-12-20 |
Electric contact element for electrochemical deposition system
App 20010000396 - Dordi, Yezdi N. ; et al. | 2001-04-26 |
Reflow ball grid array assembly
Grant 5,859,474 - Dordi January 12, 1 | 1999-01-12 |
Tape ball grid array package with perforated metal stiffener
Grant 5,835,355 - Dordi November 10, 1 | 1998-11-10 |
Paddleless molded plastic semiconductor chip package
Grant 5,604,376 - Hamburgen , et al. February 18, 1 | 1997-02-18 |
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