Doraisamy; Stanley Job
Patent Applications and Registrations
Patent applications and USPTO patent grants for Doraisamy; Stanley Job.The latest application filed is for "sensor device with flip-chip die and interposer".
- Doraisamy; Stanley Job - Seremban MY
- Doraisamy; Stanley Job - Kuala Lumpur MY
- Doraisamy; Stanley Job - Setapak MY
| Patent | Date |
|---|---|
| Sensor device with flip-chip die and interposer Grant 10,787,361 - Doraisamy , et al. September 29, 2 | 2020-09-29 |
| Sensor Device With Flip-chip Die And Interposer App 20200131026 - Doraisamy; Stanley Job ; et al. | 2020-04-30 |
| Lead frame with mold lock structure Grant 9,293,395 - Wong , et al. March 22, 2 | 2016-03-22 |
| Integrated circuit with recess for die attachment Grant 9,171,786 - Chan , et al. October 27, 2 | 2015-10-27 |
| Lead Frame With Mold Lock Structure App 20150270195 - Wong; Wai Keong ; et al. | 2015-09-24 |
| Semiconductor package with gel filled cavity Grant 9,136,399 - Doraisamy , et al. September 15, 2 | 2015-09-15 |
| Semiconductor Package With Gel Filled Cavity App 20150137278 - Doraisamy; Stanley Job ; et al. | 2015-05-21 |
| Package-on-package Semiconductor Sensor Device App 20150069537 - Lo; Wai Yew ; et al. | 2015-03-12 |
| Method of manufacturing electronic device on leadframe Grant 8,642,394 - Mohamed , et al. February 4, 2 | 2014-02-04 |
| Method of fabricating a semiconductor device having a resin with warpage compensated structures Grant 8,377,753 - Heng , et al. February 19, 2 | 2013-02-19 |
| Method of Fabricating A Semiconductor Device Having A Resin With Warpage Compensated Structures App 20120058606 - Heng; Chai Wei ; et al. | 2012-03-08 |
| Semiconductor device including isolation layer Grant 8,110,906 - Mahler , et al. February 7, 2 | 2012-02-07 |
| Semiconductor devices having a resin with warpage compensated surfaces Grant 8,067,841 - Heng , et al. November 29, 2 | 2011-11-29 |
| Semiconductor component having maximized bonding areas of electrically conductive members connected to semiconductor device and connected to leadframe and method of producing Grant 7,791,182 - Yong , et al. September 7, 2 | 2010-09-07 |
| Method of forming component package Grant 7,723,165 - Tong , et al. May 25, 2 | 2010-05-25 |
| Semiconductor Device App 20090212446 - Heng; Chai Wei ; et al. | 2009-08-27 |
| Electronic Device And Method Of Manufacturing App 20090189259 - Mohamed; Abdul Rahman ; et al. | 2009-07-30 |
| Semiconductor Component And Method Of Producing App 20090045493 - Yong; Wae Chet ; et al. | 2009-02-19 |
| Semiconductor Device Including Isolation Layer App 20080173992 - Mahler; Joachim ; et al. | 2008-07-24 |
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