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Patent applications and USPTO patent grants for Doornveld; Herman E..The latest application filed is for "testing for correct undercutting of an electrode during an etching step".
Patent | Date |
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Testing for correct undercutting of an electrode during an etching step Grant 8,063,401 - Zingg , et al. November 22, 2 | 2011-11-22 |
Testing For Correct Undercutting Of An Electrode During An Etching Step App 20100190278 - Zingg; Rene P. ;   et al. | 2010-07-29 |
Method and apparatus for applying a layer of photosensitive material to a semiconductor wafer Grant 4,668,334 - Doornveld May 26, 1 | 1987-05-26 |
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