Doong; Shyue-Ru
Patent Applications and Registrations
Patent applications and USPTO patent grants for Doong; Shyue-Ru.The latest application filed is for "operating method of etching device".
- Doong; Shyue-Ru - Taipei TW
- DOONG; Shyue-Ru - Taipei City TW
- Doong; Shyue-Ru - New Taipei TW
- DOONG; Shyue-Ru - NEW TAIPEI CITY TW
| Patent | Date |
|---|---|
| Cellular network Grant 11,329,857 - Tsai , et al. May 10, 2 | 2022-05-10 |
| Operating Method Of Etching Device App 20220102120 - TSAI; Feng-Ju ; et al. | 2022-03-31 |
| Alert device and alert method thereof Grant 11,263,755 - Doong , et al. March 1, 2 | 2022-03-01 |
| Alert Device And Alert Method Thereof App 20220020157 - DOONG; Shyue-Ru ; et al. | 2022-01-20 |
| Wafer cleaning apparatus and operation method of the same Grant 11,227,778 - Doong , et al. January 18, 2 | 2022-01-18 |
| System and method for controlling semiconductor manufacturing equipment Grant 11,189,509 - Doong , et al. November 30, 2 | 2021-11-30 |
| Cellular Network App 20210351969 - TSAI; Feng-Ju ; et al. | 2021-11-11 |
| System And Method For Controlling Semiconductor Manufacturing Equipment App 20210343561 - DOONG; Shyue-Ru ; et al. | 2021-11-04 |
| Wafer cleaning apparatus and method of cleaning wafer Grant 11,037,805 - Doong , et al. June 15, 2 | 2021-06-15 |
| Wet cleaning apparatus and manufacturing method using the same Grant 10,998,218 - Tsai , et al. May 4, 2 | 2021-05-04 |
| Wafer Cleaning Apparatus And Operation Method Of The Same App 20210050232 - DOONG; Shyue-Ru ; et al. | 2021-02-18 |
| Wafer drying equipment and method thereof Grant 10,916,452 - Tsai , et al. February 9, 2 | 2021-02-09 |
| Wafer Drying Equipment And Method Thereof App 20200176278 - DOONG; Shyue-Ru ; et al. | 2020-06-04 |
| Etching Device And Operating Method Thereof App 20200176232 - TSAI; Feng-Ju ; et al. | 2020-06-04 |
| Wafer Drying Equipment And Method Thereof App 20200176277 - TSAI; Feng-Ju ; et al. | 2020-06-04 |
| Wafer Cleaning Apparatus And Method Of Cleaning Wafer App 20200168483 - DOONG; SHYUE-RU ; et al. | 2020-05-28 |
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