DONGWON SYSTEMS CORPORATION
Patent Applications and Registrations
Patent applications and USPTO patent grants for DONGWON SYSTEMS CORPORATION.The latest application filed is for "laminated film to be applied to eco-friendly packaging material with high barrier properties".
- DONGWON SYSTEMS CORPORATION - Seongnam-si KR
- DONGWON SYSTEMS CORPORATION - Gyeonggi-do N/A KR
- Dongwon Systems Corporation - Anyang-Si KR
| Patent | Date |
|---|---|
| Laminated Film To Be Applied To Eco-friendly Packaging Material With High Barrier Properties App 20220161980 - Park; Ki Ho ; et al. | 2022-05-26 |
| Lid packing material for food container Grant 11,279,538 - Choi , et al. March 22, 2 | 2022-03-22 |
| Eco-friendly Packaging App 20210323286 - Choi; Sung Ji ; et al. | 2021-10-21 |
| Eco-friendly Container Label And Method Of Manufacturing Eco-friendly Container App 20210316538 - Choi; Sung Ji ; et al. | 2021-10-14 |
| Lid Packing Material For Food Container App 20210237950 - CHOI; Jin Seok ; et al. | 2021-08-05 |
| Constant current circuit of high efficiency Grant 8,866,538 - Kim , et al. October 21, 2 | 2014-10-21 |
| Constant Current Circuit Of High Efficiency App 20130278327 - Kim; Hyun-Tak ; et al. | 2013-10-24 |
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