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Patent applications and USPTO patent grants for Dongguan China Advanced Ceramic Technology Co., Ltd..The latest application filed is for "ceramic module for power semiconductor integrated packaging and preparation method thereof".
Patent | Date |
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Preparation method of a ceramic module for power semiconductor integrated packaging Grant 11,011,450 - Wu , et al. May 18, 2 | 2021-05-18 |
Ceramic module for power semiconductor integrated packaging and preparation method thereof Grant 10,461,016 - Wu , et al. Oc | 2019-10-29 |
Method for preparing ceramic package substrate with copper-plated dam Grant 10,297,498 - Wu | 2019-05-21 |
Ceramic Module For Power Semiconductor Integrated Packaging And Preparation Method Thereof App 20190103336 - Wu; Zhaohui ;   et al. | 2019-04-04 |
Ceramic Module For Power Semiconductor Integrated Packaging And Preparation Method Thereof App 20190019740 - Wu; Zhaohui ;   et al. | 2019-01-17 |
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