Dong; Boyu

Patent Applications and Registrations

Patent applications and USPTO patent grants for Dong; Boyu.The latest application filed is for "sputtering method".

Company Profile

6.6.8

Dong; Boyu - Beijing CN
Dong; Boyu - Tokyo JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Loading apparatus and physical vapor deposition apparatus Grant 11,315,768 - Wu , et al. April 26, 2	2022-04-26
Deposition apparatus and physical vapor deposition chamber Grant 10,984,994 - Zhang , et al. April 20, 2	2021-04-20
Heating device and heating chamber Grant 10,937,672 - Zhang , et al. March 2, 2	2021-03-02
Sputtering Method App 20210040605 - GUO; Bingliang ; et al.	2021-02-11
Loading Apparatus And Physical Vapor Deposition Apparatus App 20200144035 - WU; Xuewei ; et al.	2020-05-07
Method for forming film and method for forming aluminum nitride film Grant 10,640,862 - Wang , et al.	2020-05-05
Film forming method and aluminum nitride film forming method for semiconductor apparatus Grant 10,643,843 - Wang , et al.	2020-05-05
Deposition Apparatus And Physical Vapor Deposition Chamber App 20180247799 - ZHANG; Jun ; et al.	2018-08-30
Method For Forming Film And Method For Forming Aluminum Nitride Film App 20180230586 - WANG; Jun ; et al.	2018-08-16
Heating Device And Heating Chamber App 20170365493 - ZHANG; Jun ; et al.	2017-12-21
Film Forming Method And Aluminum Nitride Film Forming Method For Semiconductor Apparatus App 20170365466 - WANG; Jun ; et al.	2017-12-21
Polishing apparatus and polishing method Grant 9,362,129 - Miyazaki , et al. June 7, 2	2016-06-07
Polishing Apparatus And Polishing Method App 20140120725 - MIYAZAKI; Mitsuru ; et al.	2014-05-01
Substrate Processing Apparatus App 20140083468 - MIYAZAKI; Mitsuru ; et al.	2014-03-27

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