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Patent applications and USPTO patent grants for Dominic, Christopher J..The latest application filed is for "laser marking passivation film for semiconductor package".
Patent | Date |
---|---|
Laser marking passivation film for semiconductor package App 20040145060 - Dominic, Christopher J. | 2004-07-29 |
Adhesive wafers for die attach application Grant 6,620,651 - He , et al. September 16, 2 | 2003-09-16 |
Adhesive wafers for die attach application App 20030087479 - He, Xiping ;   et al. | 2003-05-08 |
Method of preparing an electronic package by co-curing adhesive and encapsulant Grant 5,972,735 - Dominic October 26, 1 | 1999-10-26 |
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