DOMINGUEZ; Juan
Patent Applications and Registrations
Patent applications and USPTO patent grants for DOMINGUEZ; Juan.The latest application filed is for "packaging solutions for high bandwidth networking applications".
- DOMINGUEZ; Juan - Chandler AZ
- Dominguez; Juan - Hillsboro OR
Trademarks
| Patent | Date |
|---|---|
| Packaging Solutions For High Bandwidth Networking Applications App 20210210478 - JADHAV; Susheel ; et al. | 2021-07-08 |
| Organometallic precursors for seed/barrier processes and methods thereof Grant 7,851,360 - Dominguez , et al. December 14, 2 | 2010-12-14 |
| Sputter Deposition Of Metal Alloy Targets Containing A High Vapor Pressure Component App 20090166181 - Jezewski; Christopher J. ; et al. | 2009-07-02 |
| Organometallic Precursors For Seed/barrier Processes And Methods Thereof App 20080194105 - Dominguez; Juan ; et al. | 2008-08-14 |
| Organometallic precursors for the chemical phase deposition of metal films in interconnect applications Grant 7,220,671 - Simka , et al. May 22, 2 | 2007-05-22 |
| Organometallic precursors for the chemical phase deposition of metal films in interconnect applications App 20060223300 - Simka; Harsono ; et al. | 2006-10-05 |
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