Dolbear; Thomas P.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Dolbear; Thomas P..The latest application filed is for "back side metallization".

Company Profile

4.14.3

Dolbear; Thomas P. - Austin TX

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Back Side Metallization App 20210183805 - Dolbear; Thomas P. ; et al.	2021-06-17
Back side metallization Grant 10,957,669 - Dolbear , et al. March 23, 2	2021-03-23
Back Side Metallization App 20190371758 - Dolbear; Thomas P. ; et al.	2019-12-05
Back side metallization Grant 10,431,562 - Dolbear , et al. O	2019-10-01
Back side metallization Grant 10,242,962 - Dolbear , et al.	2019-03-26
Low inductance power distribution system for an integrated circuit chip Grant 8,198,723 - Herrell , et al. June 12, 2	2012-06-12
Low inductance power distribution system for an integrated circuit chip Grant 6,828,666 - Herrell , et al. December 7, 2	2004-12-07
Flip chip semiconductor devices and heat sink assemblies, and the coupling thereof to form an electronic apparatus including a compliant support for supporting a heat sink App 20030085453 - Eyman, Lewis M. ; et al.	2003-05-08
Heat transfer apparatus which accommodates elevational disparity across an upper surface of a surface-mounted semiconductor device Grant 5,926,371 - Dolbear July 20, 1	1999-07-20
Low-profile heat transfer apparatus for a surface-mounted semiconductor device employing a ball grid array (BGA) device package Grant 5,907,474 - Dolbear May 25, 1	1999-05-25
Thermally conductive connection with matrix material and randomly dispersed filler containing liquid metal Grant 5,445,308 - Nelson , et al. * August 29, 1	1995-08-29
Method for encapsulating an integrated circuit using a removable heatsink support block Grant 5,344,795 - Hashemi , et al. September 6, 1	1994-09-06
Thermally and electrically conductive adhesive material and method of bonding with same Grant 5,328,087 - Nelson , et al. July 12, 1	1994-07-12
Integrated circuit structure with heat exchanger elements secured thereto and method of making Grant 5,265,321 - Nelson , et al. November 30, 1	1993-11-30
Liquid metal paste for thermal and electrical connections Grant 5,170,930 - Dolbear , et al. * December 15, 1	1992-12-15
Liquid metal paste for thermal and electrical connections Grant 5,056,706 - Dolbear , et al. October 15, 1	1991-10-15
Coiled spring heat transfer element Grant 4,993,482 - Dolbear , et al. February 19, 1	1991-02-19

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