DOI; Toshiro

Patent Applications and Registrations

Patent applications and USPTO patent grants for DOI; Toshiro.The latest application filed is for "work processing apparatus".

Company Profile

0.9.12

DOI; Toshiro - Fukuoka JP
DOI; Toshiro - Fukuoka-shi Fukuoka
Doi; Toshiro - Tokorozawa JP
Doi; Toshiro - Tokorozawa-shi JP
Doi; Toshiro - Saitama JP
Doi, Toshiro - Fujikoshi Machinery Corp. Tokorozawa-shi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Work Processing Apparatus App 20220297223 - AIDA; Hideo ; et al.	2022-09-22
Polishing pad and polishing method Grant 9,956,669 - Doi , et al. May 1, 2	2018-05-01
Ceramic composite for light conversion and method for manufacture thereof Grant 9,543,480 - Inamori , et al. January 10, 2	2017-01-10
Polishing Pad And Polishing Method App 20160016292 - DOI; Toshiro ; et al.	2016-01-21
Ceramic Composite for Light Conversion and Method for Manufacture Thereof App 20130327985 - Inamori; Dai ; et al.	2013-12-12
Polishing Slurry For Silicon Carbide And Polishing Method Therefor App 20120240479 - Doi; Toshiro ; et al.	2012-09-27
Method and apparatus for chemical mechanical polishing Grant 7,785,175 - Doi , et al. August 31, 2	2010-08-31
Polishing apparatus and method of polishing work piece Grant 7,195,546 - Doi , et al. March 27, 2	2007-03-27
Polishing apparatus and method of polishing work piece App 20060217039 - Doi; Toshiro ; et al.	2006-09-28
Polishing apparatus and method of polishing work piece Grant 7,070,486 - Doi , et al. July 4, 2	2006-07-04
Method and apparatus for chemical and mechanical polishing Grant 6,969,308 - Doi , et al. November 29, 2	2005-11-29
Method and apparatus for chemical mechanical polishing App 20050205433 - Doi, Toshiro ; et al.	2005-09-22
Method of conditioning polishing pad for semiconductor wafer App 20050164613 - Seike, Yoshiyuki ; et al.	2005-07-28
Polishing apparatus and method of polishing work piece App 20050113007 - Doi, Toshiro ; et al.	2005-05-26
Method and apparatus for chemical and mechanical polishing App 20040009738 - Doi, Toshiro ; et al.	2004-01-15

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