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name:-0.0013859272003174
name:-0.0052800178527832
Doi; Asami Patent Filings

Doi; Asami

Patent Applications and Registrations

Patent applications and USPTO patent grants for Doi; Asami.The latest application filed is for "pressure-bonding pressure-sensitive adhesive member".

Company Profile
4.1.7
  • Doi; Asami - Ibaraki JP
  • DOI; Asami - Ibaraki-shi Osaka
  • Doi; Asami - Osaka JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Separator
Grant 11,236,254 - Kosaka , et al. February 1, 2
2022-02-01
Pressure-bonding Pressure-sensitive Adhesive Member
App 20200270483 - CHIBA; Mizuho ;   et al.
2020-08-27
Separator
App 20190241769 - KOSAKA; Naofumi ;   et al.
2019-08-08
Water-dispersed Acrylic Adhesive Composition
App 20190194507 - CHIBA; Mizuho ;   et al.
2019-06-27
Adhesive Tape For Preventing Aquatic Biofouling
App 20160122593 - KURATA; Naoki ;   et al.
2016-05-05
Polymer Composition, Adhesive Composition, Temperature-responsive Sheet Produced Using Said Polymer Composition, And Cold-release Adhesive Sheet Produced Using Said Adhesive Composition
App 20150376475 - Doi; Asami ;   et al.
2015-12-31
Polymer Composition, Adhesive Composition, Temperature-responsive Sheet Produced Using Said Polymer Composition, And Cold-release Adhesive Sheet Produced Using Said Adhesive Composition
App 20140100335 - Doi; Asami ;   et al.
2014-04-10

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