Doh; Jae Cheon

Patent Applications and Registrations

Patent applications and USPTO patent grants for Doh; Jae Cheon.The latest application filed is for "electronic component module and method of manufacturing the same".

Company Profile

0.14.23

Doh; Jae Cheon - Gyunggi-do KR
Doh; Jae-Cheon - Gyeonggi-do KR
DOH; Jae Cheon - Suwon-Si KR
DOH; Jae Cheon - Suwon KR
Doh; Jae Cheon - Chungcheongnam-do KR
Doh; Jae-cheon - Cheonan-si KR
Doh; Jae-Cheon - Dujeong-dong cheonan-si KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Electric component module and method of manufacturing the same Grant 9,510,461 - Lee , et al. November 29, 2	2016-11-29
Semiconductor package and method of manufacturing the semiconductor package Grant 9,048,199 - Yoo , et al. June 2, 2	2015-06-02
Electronic Component Module And Method Of Manufacturing The Same App 20150062854 - CHOI; Seung Yong ; et al.	2015-03-05
Electric Component Module And Method Of Manufacturing The Same App 20140376193 - LEE; Il Hyeong ; et al.	2014-12-25
Electronic Component Package App 20140313676 - KANG; Joon-Seok ; et al.	2014-10-23
3D power module package Grant 8,842,438 - Kim , et al. September 23, 2	2014-09-23
Electronic component package and manufacturing method thereof Grant 8,779,580 - Kang , et al. July 15, 2	2014-07-15
Apparatus and method for inspecting defects of a circuit pattern formed on a substrate using a laser and a non-contact capacitor sensor Grant 8,410,465 - Lee , et al. April 2, 2	2013-04-02
Semiconductor Package And Method Of Manufacturing The Semiconductor Package App 20130045574 - YOO; Do-Jae ; et al.	2013-02-21
Power Device Package Module And Manufacturing Method Thereof App 20130026616 - LEE; Suk Ho ; et al.	2013-01-31
3d Power Module Package App 20120162931 - Kim; Tae Hoon ; et al.	2012-06-28
Semiconductor Package And Method Of Manufacturing The Semiconductor Package App 20110298103 - YOO; Do-Jae ; et al.	2011-12-08
Wiring substrate, solid-state imaging apparatus using the same, and manufacturing method thereof Grant 8,054,370 - Cho , et al. November 8, 2	2011-11-08
Apparatus And Method For Inspecting Defects In Circuit Pattern App 20110128011 - LEE; Seung Seoup ; et al.	2011-06-02
Wiring Substrate, Solid-state Imaging Apparatus Using The Same, And Manufacturing Method Thereof App 20100102445 - Cho; Min-Kyo ; et al.	2010-04-29
Wafer level package fabrication method Grant 7,696,004 - Yuan , et al. April 13, 2	2010-04-13
Semiconductor package film having reinforcing member and related display module Grant 7,683,476 - Lee , et al. March 23, 2	2010-03-23
Method for manufacturing semiconductor package Grant 7,670,878 - Yuan , et al. March 2, 2	2010-03-02
Wiring substrate, solid-state imaging apparatus using the same, and manufacturing method thereof Grant 7,659,936 - Cho , et al. February 9, 2	2010-02-09
Image sensor camera module and method of fabricating the same Grant 7,484,901 - Seo , et al. February 3, 2	2009-02-03
Camera module package App 20080296577 - Yuan; Jingli ; et al.	2008-12-04
Wafer level package of image sensor and method for manufacturing the same App 20080296714 - Yuan; Jingli ; et al.	2008-12-04
Wafer level package fabrication method App 20080299706 - Yuan; Jingli ; et al.	2008-12-04
Method for manufacturing semiconductor package App 20080286904 - Yuan; Jing Li ; et al.	2008-11-20
Electronic package and manufacturing method thereof App 20080211083 - Kang; Joon-Seok ; et al.	2008-09-04
Electronic component package and manufacturing method thereof App 20080212288 - Kang; Joon-Seok ; et al.	2008-09-04
Tape substrate having reinforcement layer for tape packages App 20080063789 - Chung; Ye-Chung ; et al.	2008-03-13
Semiconductor package film having reinforcing member and related display module App 20070057360 - Lee; Si-hoon ; et al.	2007-03-15
Tape substrate having reinforcement layer for tape packages App 20070042166 - Chung; Ye-Chung ; et al.	2007-02-22
Image sensor camera module and method of fabricating the same App 20060028573 - Seo; Byoung-Rim ; et al.	2006-02-09
Chip package, image sensor module including chip package, and manufacturing method thereof App 20050258502 - Kong, Yung-Cheol ; et al.	2005-11-24
Wiring substrate, solid-state imaging apparatus using the same, and manufacturing method thereof App 20050174469 - Cho, Min-Kyo ; et al.	2005-08-11
Dual die package and manufacturing method thereof App 20020113304 - Doh, Jae-Cheon ; et al.	2002-08-22

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