Doessel; Kerrin

Patent Applications and Registrations

Patent applications and USPTO patent grants for Doessel; Kerrin.The latest application filed is for "mems sensor including a diaphragm and method for manufacturing a mems sensor".

Company Profile

3.7.13

Doessel; Kerrin - Stuttgart DE

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Mems Sensor Including A Diaphragm And Method For Manufacturing A Mems Sensor App 20220041428 - Hermes; Christoph ; et al.	2022-02-10
Readout Signal Generator And Method For Operating A Capacitive Device App 20210381850 - Schelling; Christoph ; et al.	2021-12-09
Micromechanical Sensor Unit And Method For Manufacturing A Micromechanical Sensor Unit App 20210354981 - Hermes; Christoph ; et al.	2021-11-18
Micromechanical Component And Method For Producing A Micromechanical Component App 20210271073 - Eberspaecher; Alexander ; et al.	2021-09-02
Micromechanical component and production method for a micromechanical component Grant 10,868,231 - Buck , et al. December 15, 2	2020-12-15
Micromechanical sound transducer system and corresponding manufacturing method Grant 10,547,951 - Mansour , et al. Ja	2020-01-28
Method and device for processing a signal Grant 10,389,394 - Mansour , et al. A	2019-08-20
Method and Device for Processing a Signal App 20190028130 - Mansour; Ahmad ; et al.	2019-01-24
Micromechanical Sound Transducer System And Corresponding Manufacturing Method App 20180192204 - Mansour; Ahmad ; et al.	2018-07-05
Assembly body for micromirror chips, mirror device and production method for a mirror device Grant 10,012,828 - Schatz , et al. July 3, 2	2018-07-03
Micromechanical Component And Production Method For A Micromechanical Component App 20180062067 - Buck; Thomas ; et al.	2018-03-01
Mirror system and projection device Grant 9,885,866 - Straub , et al. February 6, 2	2018-02-06
Sensor And/or Transducer Device And Method For Operating A Sensor And/or Transducer Device Having At Least One Bending Structure, Which Includes At Least One Piezoelectric Layer App 20170352795 - Purkl; Fabian ; et al.	2017-12-07
Micromechanical Component And Method For Packaging A Substrate Having A Micro-electromechanical Microphone Structure Which Includes At Least One Piezoelectric Layer App 20170332176 - Pantel; Daniel ; et al.	2017-11-16
Mirror System And Projection Device App 20170052363 - Straub; Rainer ; et al.	2017-02-23
Assembly Body For Micromirror Chips, Mirror Device And Production Method For A Mirror Device App 20170052364 - Schatz; Frank ; et al.	2017-02-23
Micromechanical component and method for producing a micromechanical component Grant 9,360,664 - Armbruster , et al. June 7, 2	2016-06-07
Micromechanical Component And Method For Producing A Micromechanical Component App 20150062677 - ARMBRUSTER; Simon ; et al.	2015-03-05

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