Dobritz; Stephan

Patent Applications and Registrations

Patent applications and USPTO patent grants for Dobritz; Stephan.The latest application filed is for "chip module, use of chip module, test arrangement and test method".

Company Profile

0.8.16

Dobritz; Stephan - Dresden DE

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Chip Module, Use of Chip Module, Test Arrangement and Test Method App 20220181247 - Dobritz; Stephan ; et al.	2022-06-09
Arrangement For an Optoelectronic Component, Manufacturing Process and Optoelectronic Component App 20210408302 - Wilke; Martin ; et al.	2021-12-30
Semiconductor device Grant 8,093,696 - Yoon , et al. January 10, 2	2012-01-10
Integrated circuit, circuit system, and method of manufacturing Grant 8,072,084 - Irsigler , et al. December 6, 2	2011-12-06
Method for manufacturing a wafer level package Grant 7,867,817 - Dobritz , et al. January 11, 2	2011-01-11
Electric device, stack of electric devices, and method of manufacturing a stack of electric devices Grant 7,834,462 - Dobritz , et al. November 16, 2	2010-11-16
Semiconductor Device App 20090283899 - Yoon; Kimyung ; et al.	2009-11-19
Method for Manufacturing a Wafer Level Package App 20090194881 - Dobritz; Stephan ; et al.	2009-08-06
Integrated Circuit, Circuit System, And Method Of Manufacturing App 20090072398 - Irsigler; Roland ; et al.	2009-03-19
Electric Device, Stack of Electric Devices, and Method of Manufacturing a Stack of Electric Devices App 20090072374 - Dobritz; Stephan ; et al.	2009-03-19
Wafer Arrangement and Method for Manufacturing a Wafer Arrangement App 20090001366 - Dobritz; Stephan ; et al.	2009-01-01
Circuit board arrangement and method for producing a circuit board arrangement App 20080079149 - Hedler; Harry ; et al.	2008-04-03
Circuit board arrangement App 20070279877 - Dobritz; Stephan ; et al.	2007-12-06
Memory module App 20070230115 - Dobritz; Stephan ; et al.	2007-10-04
Interconnection element for BGA housings and method for producing the same App 20070123066 - Hanke; Andre ; et al.	2007-05-31
Interconnection element for BGA housings and method for producing the same Grant 7,220,666 - Hanke , et al. May 22, 2	2007-05-22
Integrated device and electronic system Grant 7,221,053 - Meyer , et al. May 22, 2	2007-05-22
Integrated device and electronic system App 20060208357 - Meyer; Thorsten ; et al.	2006-09-21
Arrangement for producing an electrical connection between a BGA package and a signal source, and method for producing such a connection Grant 7,068,059 - Hanke , et al. June 27, 2	2006-06-27
Leadframe of a conductive material and component with a leadframe of a conductive material Grant 6,946,721 - Dobritz , et al. September 20, 2	2005-09-20
Interconnection element for BGA housings and method for producing the same App 20050093148 - Hanke, Andre ; et al.	2005-05-05
Arrangement for producing an electrical connection between a BGA package and a signal source, and method for producing such a connection App 20050085105 - Hanke, Andre ; et al.	2005-04-21
Carrier for receiving and electrically contacting individually separated dies App 20040189333 - Dobritz, Stephan ; et al.	2004-09-30
Leadframe and component with a leadframe App 20030098498 - Dobritz, Stephan ; et al.	2003-05-29

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