loadpatents
name:-0.011688947677612
name:-0.0097551345825195
name:-0.00040292739868164
Doan; My Patent Filings

Doan; My

Patent Applications and Registrations

Patent applications and USPTO patent grants for Doan; My.The latest application filed is for "occlusive cinching devices and methods of use".

Company Profile
0.18.20
  • Doan; My - San Jose CA
  • Doan; My The - Calgary CA
  • Doan; My The - Singapore SG
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Occlusive Cinching Devices And Methods Of Use
App 20140207162 - Tran; Tri ;   et al.
2014-07-24
Detachable aneurysm neck bridge
Grant 8,529,556 - Murphy , et al. September 10, 2
2013-09-10
Detachable Aneurysm Neck Bridge
App 20130190800 - Murphy; Richard ;   et al.
2013-07-25
Detachable aneurysm neck bridge
Grant 8,449,532 - Murphy , et al. May 28, 2
2013-05-28
Detachable aneurysm neck bridge
Grant 8,372,062 - Murphy , et al. February 12, 2
2013-02-12
Detachable Aneurysm Neck Bridge
App 20120310270 - Murphy; Richard ;   et al.
2012-12-06
Detachable aneurysm neck bridge
Grant 8,267,923 - Murphy , et al. September 18, 2
2012-09-18
Detachable Aneurysm Neck Bridge
App 20110282378 - Murphy; Richard ;   et al.
2011-11-17
Occlusive Cinching Devices And Methods Of Use
App 20110118768 - Tran; Tri ;   et al.
2011-05-19
On chip antenna and method of manufacturing the same
Grant 7,911,014 - Doan March 22, 2
2011-03-22
Occlusive cinching devices and methods of use
Grant 7,892,248 - Tran , et al. February 22, 2
2011-02-22
Detachable Aneurysm Neck Bridge
App 20100222804 - Murphy; Richard ;   et al.
2010-09-02
Detachable aneurysm neck bridge
Grant 7,713,264 - Murphy , et al. May 11, 2
2010-05-11
Planar Lightwave Circuits With Air Filled Trenches
App 20090087137 - Doan; My The
2009-04-02
On Chip Antenna And Method Of Manufacturing The Same
App 20090085133 - Doan; My The
2009-04-02
Detachable Aneurysm Neck Bridge
App 20080281302 - Murphy; Richard ;   et al.
2008-11-13
Detachable aneurysm neck bridge
Grant 7,410,482 - Murphy , et al. August 12, 2
2008-08-12
VLSI-photonic heterogeneous integration by wafer bonding
Grant 7,349,614 - Doan March 25, 2
2008-03-25
Occlusive Cinching Devices and Methods of Use
App 20070213764 - Tran; Tri ;   et al.
2007-09-13
Method to trim and smooth high index contrast waveguide structures
Grant 7,248,773 - Chang , et al. July 24, 2
2007-07-24
Occlusive cinching devices and methods of use
Grant 7,229,454 - Tran , et al. June 12, 2
2007-06-12
Method to trim and smooth high index contrast waveguide structures
App 20070090089 - Chang; Chang Kuo ;   et al.
2007-04-26
VLSI-photonic heterogeneous integration by wafer bonding
Grant 7,203,387 - Doan April 10, 2
2007-04-10
VLSI-photonic heterogeneous integration by wafer bonding
App 20070077018 - Doan; My The
2007-04-05
Method of fabricating optical waveguide devices with smooth and flat dielectric interfaces
Grant 7,164,837 - Kang , et al. January 16, 2
2007-01-16
Method to trim and smooth high index contrast waveguide structures
Grant 7,162,133 - Chang , et al. January 9, 2
2007-01-09
Method to trim and smooth high index contrast waveguide structures
App 20060037364 - Chang; Chang Kuo ;   et al.
2006-02-23
VLSI-photonic heterogeneous integration by wafer bonding
App 20050053319 - Doan, My The
2005-03-10
Tunable low loss transmission lines
App 20040238950 - Doan, My The
2004-12-02
Occlusive cinching devices and methods of use
App 20040133222 - Tran, Tri ;   et al.
2004-07-08
Method of fabricating optical waveguide devices with smooth and flat dielectric interfaces
App 20040120677 - Mo Kang, Joon ;   et al.
2004-06-24
Detachable aneurysm neck bridge
App 20030171739 - Murphy, Richard ;   et al.
2003-09-11
Method of thick film planarization
Grant 6,617,241 - Doan September 9, 2
2003-09-09
Single damascene method for RF IC passive component integration in copper interconnect process
Grant 6,534,374 - Johnson , et al. March 18, 2
2003-03-18
Single damascene method for RF IC passive component integration in copper interconnect process
App 20020197844 - Johnson, Eric ;   et al.
2002-12-26

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